织构对压制半导体热电性能形成的影响

L. Anatychuk, S. V. Kosyachenko, S. V. Melnichuk
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引用次数: 1

摘要

研究了热电性能与织构层厚度的关系。由于织构层厚度的减小,导致了导热系数和电导率的降低。塞贝克系数和优值保持不变。
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Texture influence on the forming of thermoelectric properties of pressed semiconductors
The dependence of thermoelectric properties on the texture layer thickness was investigated. The electric and thermal conductivities decrease is caused by decrease of texture layer thickness. Seebeck coefficient and figure of merit remain constant.
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