MEMS传声器用硅基铂膜的制备

A. A. Hamzah, B. Y. Majlis, I. Ahmad
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引用次数: 2

摘要

制备了具有氮化硅层的铂膜,并对其进行了分析。该薄膜由溅射铂和CVD氮化硅制成,专为MEMS麦克风应用而设计。成功制备了厚度为6.35 μ m的铂-氮化铂夹层膜。利用Tencor表面剖面仪测量所制膜在给定压力下的挠度。我们观察到,当压力在20 Pa到200 Pa之间时,其中心的挠度与施加的压力成正比。施加200帕压力时,平均中心挠度测量为0.41毫微米。所制备的铂膜在声压范围内具有良好的线性偏转响应,适合MEMS传声器的应用。
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Fabrication of Platinum Membrane on Silicon for MEMS Microphone
Platinum membrane with silicon nitride layer is fabricated and analyzed. The membrane, which is designed for MEMS microphone application, is fabricated using sputter platinum and CVD silicon nitride. Membranes with sandwich layer of platinum-nitride-platinum with thickness of 6.35 mum are successfully fabricated. Deflection of the fabricated membrane corresponding to given pressure is measured using Tencor surface profiler. It is observed that deflection at its center is proportional to applied pressure for pressure between 20 Pa to 200 Pa. Average center deflection for applied pressure of 200 Pa is measured to be 0.41 mum. The fabricated platinum membrane is deemed suitable for MEMS microphone application due to its linear deflection response in acoustic pressure range.
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