SOC高效片上互连架构的发展综述

Naman Batra, Brahmjit Singh
{"title":"SOC高效片上互连架构的发展综述","authors":"Naman Batra, Brahmjit Singh","doi":"10.1109/GlobConPT57482.2022.9938209","DOIUrl":null,"url":null,"abstract":"Constant improvements in transistor technology have made it possible for computer design to support ever-increasing numbers of processing cores on a single silicon die. With the number of cores on a chip and complexity increasing, there is a greater need for on-chip communication capacity. As per recent research outcomes the packet-switched network-on-chip (NoC) proved to be a most scalable cores and low-cost communication fabric systems with dozens or even hundreds of processors' core. So, In this paper the performance, features, pros and cons of all the traditional on-chip interconnect architecture like Buses, Crossbar, Network-on-chip are reviewed. This is then followed by the review of the most frequent benefits and downsides of NoC's current power-saving practices.","PeriodicalId":431406,"journal":{"name":"2022 IEEE Global Conference on Computing, Power and Communication Technologies (GlobConPT)","volume":"139 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-09-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Evolution of Efficient On-Chip Interconnect Architecture for SOC: A Review\",\"authors\":\"Naman Batra, Brahmjit Singh\",\"doi\":\"10.1109/GlobConPT57482.2022.9938209\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Constant improvements in transistor technology have made it possible for computer design to support ever-increasing numbers of processing cores on a single silicon die. With the number of cores on a chip and complexity increasing, there is a greater need for on-chip communication capacity. As per recent research outcomes the packet-switched network-on-chip (NoC) proved to be a most scalable cores and low-cost communication fabric systems with dozens or even hundreds of processors' core. So, In this paper the performance, features, pros and cons of all the traditional on-chip interconnect architecture like Buses, Crossbar, Network-on-chip are reviewed. This is then followed by the review of the most frequent benefits and downsides of NoC's current power-saving practices.\",\"PeriodicalId\":431406,\"journal\":{\"name\":\"2022 IEEE Global Conference on Computing, Power and Communication Technologies (GlobConPT)\",\"volume\":\"139 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-09-23\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 IEEE Global Conference on Computing, Power and Communication Technologies (GlobConPT)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/GlobConPT57482.2022.9938209\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE Global Conference on Computing, Power and Communication Technologies (GlobConPT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/GlobConPT57482.2022.9938209","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

晶体管技术的不断改进使计算机设计能够在单个硅芯片上支持不断增加的处理核心数量。随着芯片上的核心数量和复杂性的增加,对片上通信容量的需求也越来越大。根据最近的研究成果,包交换片上网络(NoC)被证明是具有数十甚至数百个处理器核心的最具可扩展性和低成本的通信结构系统。因此,本文对传统的片上互连结构,如总线、Crossbar、片上网络等的性能、特点、优缺点进行了综述。然后,回顾NoC当前节能实践中最常见的优点和缺点。
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Evolution of Efficient On-Chip Interconnect Architecture for SOC: A Review
Constant improvements in transistor technology have made it possible for computer design to support ever-increasing numbers of processing cores on a single silicon die. With the number of cores on a chip and complexity increasing, there is a greater need for on-chip communication capacity. As per recent research outcomes the packet-switched network-on-chip (NoC) proved to be a most scalable cores and low-cost communication fabric systems with dozens or even hundreds of processors' core. So, In this paper the performance, features, pros and cons of all the traditional on-chip interconnect architecture like Buses, Crossbar, Network-on-chip are reviewed. This is then followed by the review of the most frequent benefits and downsides of NoC's current power-saving practices.
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