Delphi4LED -从LED的测量到标准化的多域紧凑模型:一个新的欧洲研发项目,用于在SSL供应链的所有集成级别对LED进行预测和高效的多域建模和仿真

R. Bornoff, V. Hildenbrand, Sangye Lugten, G. Martin, C. Marty, A. Poppe, M. Rencz, W. Schilders, Joan Yu
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引用次数: 23

摘要

在SSL供应链的不同集成级别上,存在一些阻碍产品有效设计的瓶颈。一个主要的问题是,不同的LED供应商提供的封装LED的数据表信息通常是不充分和不一致的。许多数据,如不同光输出特性的温度灵敏度,只能在有限的范围内提供,并且通常通过绘图的方式提供。此外,报告的光输出特性通常额定结温为25°C,这明显低于实际操作条件下预期的结温。即使在结温为85°C的情况下测量“热流明”,这也不是实际的工作温度,而且关于如何进行这种“热流明”测试的信息很少。报告的LED测试数据与实际工作条件之间的差距可以通过适当的LED及其环境仿真模型来弥补。这样的模型应该是准确的,因此能够正确地预测LED的工作,但足够简单,以确保快速的数值模拟。然而,LED集成无法获得详细的LED信息来执行系统级的仿真,因此执行逆向工程既费时又耗钱。必须在半导体产业和LED元件集成商之间以标准化的形式建立一座桥梁。为了实现这一目标,必须提供以下工具:·LED芯片的通用多域模型·LED芯片环境(包括封装和模块组装)的紧凑型热模型·灯具的建模接口。该项目的目标是开发一种标准化方法,从测试数据创建多域LED紧凑型模型。
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Delphi4LED — from measurements to standardized multi-domain compact models of LED: A new European R&D project for predictive and efficient multi-domain modeling and simulation of LEDs at all integration levels along the SSL supply chain
There are a few bottlenecks hampering efficient design of products on different integration levels of the SSL supply chain. One major issue is that data sheet information provided about packaged LEDs is usually insufficient and inconsistent among different LED vendors. Many data such as temperature sensitivity of different light output properties are provided to a limited extent only and usually by means of plots. Also, reported light output properties are typically rated for a junction temperature of 25 °C, which is obviously much below the junction temperature expected under real operating conditions. Even if “hot lumens” measured at a junction temperature of 85 °C this is not the actual operating temperature and there is little information about how such “hot lumen” tests are performed. The gap between and reported LED test data and actual operating conditions can be bridged by proper simulation models of LEDs and their environments. Such models should be accurate, hence capable of proper prediction of LED operation but simple enough to assure fast numerical simulations. However, LED integration do not get access to detailed LED information to perform those simulation at system level, thus perform reverse engineering which is time and cost consuming. A bridge, in the form of standardization, has to be established between the semiconductor industry and the LED component integrators. In order to achieve this, the following tools have to be provided: · Generic, multi-domain model of LED chips · Compact thermal model of the LED chips `environment (including the package and module assembly) · Modeling interface towards the luminaire The goal of the project is to develop a standardized method to create multi-domain LED compact models from testing data.
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