An efficient method for power integrity and EMI Analysis of advanced packages

A two-dimensional full-wave method is presented in this paper for efficient power integrity and EMI Analysis of highspeed electronic packages. The power/ground planes in electronic packages form a parallel-plate structure, which is solved by a 2D finite-different time domain (2D FDTD) method. Both the conductor loss and the substrate loss are modeled by the 2D method. Besides the parallel-plate structure, electronic packages also comprise of many transmission lines including microstrip- and stripline-type structures. Those two types of structures are also resolved by the 2D method. So a unified solver may be developed in the context of 2D method for the signal and power integrity analysis of electronic packages. The electromagnetic interference (EMI) issue of electronic packages is also touched in this paper, which is mainly focused on the radiation due to the edge effect of the parallel plate structure in a package. Numerical examples are given to demonstrate the method.