{"title":"使用温度变化的电沉积方法形成合成物","authors":"Assita Wahyu Andiani, Esmar Budi, I. Sugihartono","doi":"10.21009/03.snf2019.02.pa.20","DOIUrl":null,"url":null,"abstract":"Research was conducted on coating process of the Ni-TiAlN/Si3N4 composite film to study the effect of various temperature on the surface morphology of the Ni-TiAlN/Si3N4 composite film. The coating process was conducted by electrodeposition method with a 5 mA of current for 15 minutes on tungsten carbide substrate with electrolyte solution that consists of 6 g/L AlN, 6 g/L TiN, 40 g/L H3BO3, 0.6 g/L Si3N4, 0.17 M NiCl2.6H2O, 0.38 M NiSO4.6H2O dan 0,6 g/L Sodium Dodecyl Sulfate. Variations temperature is 35°C, 40°C and 45°C The composite film morphology was characterized by Scanning Electron Microscopy (SEM). The results showed that as temperature increased, the Ni-TiAlN/Si3N4 composite film morphology was formed increasingly uneven, has coarser grain shape and not homogenous.","PeriodicalId":444001,"journal":{"name":"PROSIDING SEMINAR NASIONAL FISIKA (E-JOURNAL) SNF2019 UNJ","volume":"45 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"PEMBENTUKAN LAPISAN KOMPOSIT Ni- TiAlN/Si3N4 MENGGUNAKAN METODE ELEKTRODEPOSISI DENGAN VARIASI TEMPERATUR\",\"authors\":\"Assita Wahyu Andiani, Esmar Budi, I. Sugihartono\",\"doi\":\"10.21009/03.snf2019.02.pa.20\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Research was conducted on coating process of the Ni-TiAlN/Si3N4 composite film to study the effect of various temperature on the surface morphology of the Ni-TiAlN/Si3N4 composite film. The coating process was conducted by electrodeposition method with a 5 mA of current for 15 minutes on tungsten carbide substrate with electrolyte solution that consists of 6 g/L AlN, 6 g/L TiN, 40 g/L H3BO3, 0.6 g/L Si3N4, 0.17 M NiCl2.6H2O, 0.38 M NiSO4.6H2O dan 0,6 g/L Sodium Dodecyl Sulfate. Variations temperature is 35°C, 40°C and 45°C The composite film morphology was characterized by Scanning Electron Microscopy (SEM). The results showed that as temperature increased, the Ni-TiAlN/Si3N4 composite film morphology was formed increasingly uneven, has coarser grain shape and not homogenous.\",\"PeriodicalId\":444001,\"journal\":{\"name\":\"PROSIDING SEMINAR NASIONAL FISIKA (E-JOURNAL) SNF2019 UNJ\",\"volume\":\"45 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1900-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"PROSIDING SEMINAR NASIONAL FISIKA (E-JOURNAL) SNF2019 UNJ\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.21009/03.snf2019.02.pa.20\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"PROSIDING SEMINAR NASIONAL FISIKA (E-JOURNAL) SNF2019 UNJ","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.21009/03.snf2019.02.pa.20","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
摘要
对Ni-TiAlN/Si3N4复合膜的涂层工艺进行了研究,研究了不同温度对Ni-TiAlN/Si3N4复合膜表面形貌的影响。以6 g/L AlN、6 g/L TiN、40 g/L H3BO3、0.6 g/L Si3N4、0.17 M NiCl2.6H2O、0.38 M NiSO4.6H2O和0、6 g/L十二烷基硫酸钠为电解液,以5 mA电流在碳化钨衬底上电沉积15分钟。温度变化为35℃、40℃和45℃,通过扫描电镜(SEM)对复合膜的形貌进行了表征。结果表明:随着温度的升高,Ni-TiAlN/Si3N4复合膜形貌越来越不均匀,晶粒形状粗糙,不均匀;
PEMBENTUKAN LAPISAN KOMPOSIT Ni- TiAlN/Si3N4 MENGGUNAKAN METODE ELEKTRODEPOSISI DENGAN VARIASI TEMPERATUR
Research was conducted on coating process of the Ni-TiAlN/Si3N4 composite film to study the effect of various temperature on the surface morphology of the Ni-TiAlN/Si3N4 composite film. The coating process was conducted by electrodeposition method with a 5 mA of current for 15 minutes on tungsten carbide substrate with electrolyte solution that consists of 6 g/L AlN, 6 g/L TiN, 40 g/L H3BO3, 0.6 g/L Si3N4, 0.17 M NiCl2.6H2O, 0.38 M NiSO4.6H2O dan 0,6 g/L Sodium Dodecyl Sulfate. Variations temperature is 35°C, 40°C and 45°C The composite film morphology was characterized by Scanning Electron Microscopy (SEM). The results showed that as temperature increased, the Ni-TiAlN/Si3N4 composite film morphology was formed increasingly uneven, has coarser grain shape and not homogenous.