{"title":"一个容错和完全可测试的PLA","authors":"N. Wehn, M. Glesner, K. Caesar, P. Mann, A. Roth","doi":"10.1109/DAC.1988.14729","DOIUrl":null,"url":null,"abstract":"The authors present a defect-tolerant and fully testable programmable logic array (PLA) that allows the repair of a defective chip. The repair process is described. Special emphasis is placed on the location of defects inside a PLA. The defect location mechanism is completely topological and circuit-independent and therefore easy to adapt to existing PLA generators. Yield considerations for this type of PLA are presented.<<ETX>>","PeriodicalId":230716,"journal":{"name":"25th ACM/IEEE, Design Automation Conference.Proceedings 1988.","volume":"216 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1988-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"15","resultStr":"{\"title\":\"A defect-tolerant and fully testable PLA\",\"authors\":\"N. Wehn, M. Glesner, K. Caesar, P. Mann, A. Roth\",\"doi\":\"10.1109/DAC.1988.14729\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The authors present a defect-tolerant and fully testable programmable logic array (PLA) that allows the repair of a defective chip. The repair process is described. Special emphasis is placed on the location of defects inside a PLA. The defect location mechanism is completely topological and circuit-independent and therefore easy to adapt to existing PLA generators. Yield considerations for this type of PLA are presented.<<ETX>>\",\"PeriodicalId\":230716,\"journal\":{\"name\":\"25th ACM/IEEE, Design Automation Conference.Proceedings 1988.\",\"volume\":\"216 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1988-06-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"15\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"25th ACM/IEEE, Design Automation Conference.Proceedings 1988.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/DAC.1988.14729\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"25th ACM/IEEE, Design Automation Conference.Proceedings 1988.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/DAC.1988.14729","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The authors present a defect-tolerant and fully testable programmable logic array (PLA) that allows the repair of a defective chip. The repair process is described. Special emphasis is placed on the location of defects inside a PLA. The defect location mechanism is completely topological and circuit-independent and therefore easy to adapt to existing PLA generators. Yield considerations for this type of PLA are presented.<>
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