EDA机器学习中的安全性和可靠性挑战:最新进展

Zhiyao Xie, Tao Zhang, Yifeng Peng
{"title":"EDA机器学习中的安全性和可靠性挑战:最新进展","authors":"Zhiyao Xie, Tao Zhang, Yifeng Peng","doi":"10.1109/ISQED57927.2023.10129359","DOIUrl":null,"url":null,"abstract":"The growing IC complexity has led to a compelling need for design efficiency improvement through new electronic design automation (EDA) methodologies. In recent years, many innovative machine learning (ML)-based solutions have been proposed for EDA applications. While these ML solutions demonstrate great potential in the circuit design flow, however, the hidden security and model reliability problems are rarely discussed until recently. In this paper, we present some latest research advances in the security and reliability challenges in ML for EDA.","PeriodicalId":315053,"journal":{"name":"2023 24th International Symposium on Quality Electronic Design (ISQED)","volume":"618 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-04-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Security and Reliability Challenges in Machine Learning for EDA: Latest Advances\",\"authors\":\"Zhiyao Xie, Tao Zhang, Yifeng Peng\",\"doi\":\"10.1109/ISQED57927.2023.10129359\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The growing IC complexity has led to a compelling need for design efficiency improvement through new electronic design automation (EDA) methodologies. In recent years, many innovative machine learning (ML)-based solutions have been proposed for EDA applications. While these ML solutions demonstrate great potential in the circuit design flow, however, the hidden security and model reliability problems are rarely discussed until recently. In this paper, we present some latest research advances in the security and reliability challenges in ML for EDA.\",\"PeriodicalId\":315053,\"journal\":{\"name\":\"2023 24th International Symposium on Quality Electronic Design (ISQED)\",\"volume\":\"618 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2023-04-05\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2023 24th International Symposium on Quality Electronic Design (ISQED)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISQED57927.2023.10129359\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2023 24th International Symposium on Quality Electronic Design (ISQED)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISQED57927.2023.10129359","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

日益增长的集成电路复杂性导致迫切需要通过新的电子设计自动化(EDA)方法来提高设计效率。近年来,许多基于机器学习(ML)的创新解决方案被提出用于EDA应用。虽然这些机器学习解决方案在电路设计流程中显示出巨大的潜力,然而,隐藏的安全性和模型可靠性问题直到最近才被讨论。本文介绍了面向EDA的机器学习在安全性和可靠性方面的一些最新研究进展。
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Security and Reliability Challenges in Machine Learning for EDA: Latest Advances
The growing IC complexity has led to a compelling need for design efficiency improvement through new electronic design automation (EDA) methodologies. In recent years, many innovative machine learning (ML)-based solutions have been proposed for EDA applications. While these ML solutions demonstrate great potential in the circuit design flow, however, the hidden security and model reliability problems are rarely discussed until recently. In this paper, we present some latest research advances in the security and reliability challenges in ML for EDA.
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