{"title":"高效率的850nm垂直腔面发射激光器，采用扇垫金属化和沟槽图案","authors":"M. Alias, P. Leisher, K. Choquette, S. Shaari","doi":"10.1109/IEMT.2008.5507777","DOIUrl":null,"url":null,"abstract":"In this paper, fan-pad metallization and trench patterning were introduced in 850 nm Vertical-Cavity Surface-Emitting Laser (VCSEL) device packaging. Low threshold current and series resistance, which contributes to higher VCSEL efficiency, are obtained for the VCSEL with fan-metallization and trench patterning fabricated devices. Further, the output spectral characteristics show stable multimode operation for these devices. The results indicate that the proposed VCSEL packaging exhibits superior device performance compared to typical packaged VCSEL with square-pad metal.","PeriodicalId":151085,"journal":{"name":"2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)","volume":"64 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2008-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"High efficiency 850 nm Vertical-Cavity Surface-Emitting Laser using fan-pad metallization and trench patterning\",\"authors\":\"M. Alias, P. Leisher, K. Choquette, S. Shaari\",\"doi\":\"10.1109/IEMT.2008.5507777\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, fan-pad metallization and trench patterning were introduced in 850 nm Vertical-Cavity Surface-Emitting Laser (VCSEL) device packaging. Low threshold current and series resistance, which contributes to higher VCSEL efficiency, are obtained for the VCSEL with fan-metallization and trench patterning fabricated devices. Further, the output spectral characteristics show stable multimode operation for these devices. The results indicate that the proposed VCSEL packaging exhibits superior device performance compared to typical packaged VCSEL with square-pad metal.\",\"PeriodicalId\":151085,\"journal\":{\"name\":\"2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)\",\"volume\":\"64 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2008-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEMT.2008.5507777\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMT.2008.5507777","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
High efficiency 850 nm Vertical-Cavity Surface-Emitting Laser using fan-pad metallization and trench patterning
In this paper, fan-pad metallization and trench patterning were introduced in 850 nm Vertical-Cavity Surface-Emitting Laser (VCSEL) device packaging. Low threshold current and series resistance, which contributes to higher VCSEL efficiency, are obtained for the VCSEL with fan-metallization and trench patterning fabricated devices. Further, the output spectral characteristics show stable multimode operation for these devices. The results indicate that the proposed VCSEL packaging exhibits superior device performance compared to typical packaged VCSEL with square-pad metal.
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