{"title":"集成电路老化对射频固有属性(RF-DNA)的影响","authors":"Randall D. Deppensmith, Samuel J. Stone","doi":"10.1109/NAECON.2014.7045830","DOIUrl":null,"url":null,"abstract":"Device discrimination using RF-DNA utilizes the uniqueness resulting from integrated circuit (IC) manufacturing process variation. As an IC ages toward wear-out failure, internal physical alterations may impart additional changes on the order of initial process variations. This paper proposes exploration of: 1) the impact of aging on RF-DNA discrimination reliability, and 2) a means to monitor IC aging using RF-DNA.","PeriodicalId":318539,"journal":{"name":"NAECON 2014 - IEEE National Aerospace and Electronics Conference","volume":"59 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-06-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Integrated circuit (IC) aging effects on radio-frequency distinct native attributes (RF-DNA)\",\"authors\":\"Randall D. Deppensmith, Samuel J. Stone\",\"doi\":\"10.1109/NAECON.2014.7045830\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Device discrimination using RF-DNA utilizes the uniqueness resulting from integrated circuit (IC) manufacturing process variation. As an IC ages toward wear-out failure, internal physical alterations may impart additional changes on the order of initial process variations. This paper proposes exploration of: 1) the impact of aging on RF-DNA discrimination reliability, and 2) a means to monitor IC aging using RF-DNA.\",\"PeriodicalId\":318539,\"journal\":{\"name\":\"NAECON 2014 - IEEE National Aerospace and Electronics Conference\",\"volume\":\"59 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-06-24\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"NAECON 2014 - IEEE National Aerospace and Electronics Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/NAECON.2014.7045830\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"NAECON 2014 - IEEE National Aerospace and Electronics Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/NAECON.2014.7045830","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Device discrimination using RF-DNA utilizes the uniqueness resulting from integrated circuit (IC) manufacturing process variation. As an IC ages toward wear-out failure, internal physical alterations may impart additional changes on the order of initial process variations. This paper proposes exploration of: 1) the impact of aging on RF-DNA discrimination reliability, and 2) a means to monitor IC aging using RF-DNA.
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