互连电阻和电容的统计和拐角建模

IEEE Custom Integrated Circuits Conference 2006 Pub Date : 2006-09-01 DOI:10.1109/CICC.2006.320845

N. Lu

{"title":"互连电阻和电容的统计和拐角建模","authors":"N. Lu","doi":"10.1109/CICC.2006.320845","DOIUrl":null,"url":null,"abstract":"We describe an innovative and comprehensive interconnect Spice model for IBM 65 nm technology. The model links the variability in the model to the variations in BEOL litho, deposition, etch, and polish process steps, which is an industry first. It provides correct Monte Carlo simulation results, offers correct corner modeling capability, and can also generates a set of optimal interconnect corner models instantly without running Monte Carlo simulations, which is another industry first","PeriodicalId":269854,"journal":{"name":"IEEE Custom Integrated Circuits Conference 2006","volume":"662 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"10","resultStr":"{\"title\":\"Statistical and Corner Modeling of Interconnect Resistance and Capacitance\",\"authors\":\"N. Lu\",\"doi\":\"10.1109/CICC.2006.320845\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We describe an innovative and comprehensive interconnect Spice model for IBM 65 nm technology. The model links the variability in the model to the variations in BEOL litho, deposition, etch, and polish process steps, which is an industry first. It provides correct Monte Carlo simulation results, offers correct corner modeling capability, and can also generates a set of optimal interconnect corner models instantly without running Monte Carlo simulations, which is another industry first\",\"PeriodicalId\":269854,\"journal\":{\"name\":\"IEEE Custom Integrated Circuits Conference 2006\",\"volume\":\"662 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2006-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"10\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Custom Integrated Circuits Conference 2006\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/CICC.2006.320845\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Custom Integrated Circuits Conference 2006","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CICC.2006.320845","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 10

摘要

我们描述了IBM 65纳米技术的创新和全面的互连Spice模型。该模型将模型中的可变性与BEOL光刻、沉积、蚀刻和抛光工艺步骤的变化联系起来，这是行业首创。它提供了正确的蒙特卡罗仿真结果，提供了正确的拐角建模能力，并且还可以在不运行蒙特卡罗仿真的情况下立即生成一组最优的互连拐角模型，这是另一个行业首创

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文

微信好友朋友圈 QQ好友复制链接

本刊更多论文

Statistical and Corner Modeling of Interconnect Resistance and Capacitance

We describe an innovative and comprehensive interconnect Spice model for IBM 65 nm technology. The model links the variability in the model to the variations in BEOL litho, deposition, etch, and polish process steps, which is an industry first. It provides correct Monte Carlo simulation results, offers correct corner modeling capability, and can also generates a set of optimal interconnect corner models instantly without running Monte Carlo simulations, which is another industry first

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

IEEE Custom Integrated Circuits Conference 2006

自引率

0.00%

发文量

期刊最新文献

Compact outside-rail circuit structure by single-cascode two-transistor topology Width Quantization Aware FinFET Circuit Design Chip-to-Chip Inductive Wireless Power Transmission System for SiP Applications Wireline equalization using pulse-width modulation A 5Gb/s Transmitter with Reflection Cancellation for Backplane Transceivers