玻璃通孔基板上集成微带线的共面波导

C. Chiu, C. Zhan
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引用次数: 0

摘要

提出了一种基于微带线的玻璃通孔基板宽带共面波导。设计了用于输入/输出端口的超宽带微带向共面波导过渡。垂直通过将顶部共面波导连接到基片底部的接地面上,以实现最短的信号传输距离。模拟将玻璃介电层厚度(εr=5.5)从200μm限制到500μm,均实现了高达30Gz的频段。我们设计了一个中心导电宽度为120μm,间距为22μm的共面波导,连接导电宽度为210μm的微带线,最终实现了整体结构的50Ω阻抗匹配。仿真结果表明,该天线在30 GHz频段的插入损耗小于0.09dB,反射损耗小于-20dB。
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Coplanar Waveguide Integrated with Micro-Strip Line on a Through Glass Via Substrate
A wideband coplanar waveguide integrated with micro-strip line on a through glass via substrate is presented. The design of the ultra-wideband micro-strip to coplanar waveguide transition, which are used at input/output ports. Vertical via connecting the top coplanar waveguide to the ground plane on the bottom of the substrate to achieve the shortest signal transmission distance. Simulated the maximum to limit the minimum thickness of the glass dielectric layer (εr=5.5) from 200μm to 500μm have all implemented up to 30Gz frequency band. We have designed a coplanar waveguide with the center conductive width of 120μm and space of 22μm to connecting a micro strip line with the conductive width of 210μm, finally reaching 50Ω impedance matching of overall structure. The simulation results have a low insertion loss of less than 0.09dB and the reflection loss of below -20dB at 30 GHz frequency band.
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