H. Pues, Ben Brike, C. Gazda, P. Teichmann, K. Stijnen, Christian Peeters, A. Durier, D. Ginste
{"title":"利用s参数集成电路模型将汽车模块射频抗扰度测试极限转换为等效集成电路测试极限","authors":"H. Pues, Ben Brike, C. Gazda, P. Teichmann, K. Stijnen, Christian Peeters, A. Durier, D. Ginste","doi":"10.1109/EMCCOMPO.2013.6735209","DOIUrl":null,"url":null,"abstract":"A method to translate immunity specifications of automotive modules into equivalent requirements at integrated circuit (IC) level, using linear scattering parameter models of the ICs, is presented. A technique is described to determine S-parameters of ICs by simulations based on back-annotated analog schematics. The simulation results are compared with measurement data obtained using a specially designed test board. As an example, simulation and measurement results are given for the input stage of an automotive sensor interface. A good agreement is obtained from the lowest test frequency up to 1 GHz. Above this value, the measured results seem to be dominated by package effects.","PeriodicalId":302757,"journal":{"name":"2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"154 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Translation of automotive module RF immunity test limits into equivalent IC test limits using S-parameter IC models\",\"authors\":\"H. Pues, Ben Brike, C. Gazda, P. Teichmann, K. Stijnen, Christian Peeters, A. Durier, D. Ginste\",\"doi\":\"10.1109/EMCCOMPO.2013.6735209\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A method to translate immunity specifications of automotive modules into equivalent requirements at integrated circuit (IC) level, using linear scattering parameter models of the ICs, is presented. A technique is described to determine S-parameters of ICs by simulations based on back-annotated analog schematics. The simulation results are compared with measurement data obtained using a specially designed test board. As an example, simulation and measurement results are given for the input stage of an automotive sensor interface. A good agreement is obtained from the lowest test frequency up to 1 GHz. Above this value, the measured results seem to be dominated by package effects.\",\"PeriodicalId\":302757,\"journal\":{\"name\":\"2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo)\",\"volume\":\"154 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2013-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EMCCOMPO.2013.6735209\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EMCCOMPO.2013.6735209","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Translation of automotive module RF immunity test limits into equivalent IC test limits using S-parameter IC models
A method to translate immunity specifications of automotive modules into equivalent requirements at integrated circuit (IC) level, using linear scattering parameter models of the ICs, is presented. A technique is described to determine S-parameters of ICs by simulations based on back-annotated analog schematics. The simulation results are compared with measurement data obtained using a specially designed test board. As an example, simulation and measurement results are given for the input stage of an automotive sensor interface. A good agreement is obtained from the lowest test frequency up to 1 GHz. Above this value, the measured results seem to be dominated by package effects.