{"title":"3-D存储器的并行数据传输","authors":"S. Esener, F. Mccormick","doi":"10.1109/LEOS.1996.565175","DOIUrl":null,"url":null,"abstract":"In this presentation we will discuss possible optoelectronic packaging technologies that can provide the much needed compactness and light weight to future parallel readout optical heads. Based on the characteristics of these technologies we will discuss possible data rates that can be achieved over the next decade by volumetric optical disk systems and discuss their potential applications.","PeriodicalId":332726,"journal":{"name":"Conference Proceedings LEOS'96 9th Annual Meeting IEEE Lasers and Electro-Optics Society","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"1996-11-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Parallel data transfer from 3-D memories\",\"authors\":\"S. Esener, F. Mccormick\",\"doi\":\"10.1109/LEOS.1996.565175\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this presentation we will discuss possible optoelectronic packaging technologies that can provide the much needed compactness and light weight to future parallel readout optical heads. Based on the characteristics of these technologies we will discuss possible data rates that can be achieved over the next decade by volumetric optical disk systems and discuss their potential applications.\",\"PeriodicalId\":332726,\"journal\":{\"name\":\"Conference Proceedings LEOS'96 9th Annual Meeting IEEE Lasers and Electro-Optics Society\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1996-11-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Conference Proceedings LEOS'96 9th Annual Meeting IEEE Lasers and Electro-Optics Society\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/LEOS.1996.565175\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Conference Proceedings LEOS'96 9th Annual Meeting IEEE Lasers and Electro-Optics Society","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/LEOS.1996.565175","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
In this presentation we will discuss possible optoelectronic packaging technologies that can provide the much needed compactness and light weight to future parallel readout optical heads. Based on the characteristics of these technologies we will discuss possible data rates that can be achieved over the next decade by volumetric optical disk systems and discuss their potential applications.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
