W. Simon, R. Kulke, A. Wien, M. Rittweger, I. Wolff, A. Girard, J. Bertinet
{"title":"用于24 GHz ism频段应用的多层LTCC多芯片模块的互连和转换","authors":"W. Simon, R. Kulke, A. Wien, M. Rittweger, I. Wolff, A. Girard, J. Bertinet","doi":"10.1109/MWSYM.2000.863536","DOIUrl":null,"url":null,"abstract":"Multilayer LTCC substrates with screen printed conductors are considered as a key technology for coming RF wireless communication and automotive applications. Small but expensive MMICs should be integrated in a much cheaper LTCC environment to become a multichip module (MCM). Interconnects between the environmental waveguides and the integrated chips have been designed, optimized, fabricated and evaluated by the authors, which are partners in the European R&D project RAMP.","PeriodicalId":149404,"journal":{"name":"2000 IEEE MTT-S International Microwave Symposium Digest (Cat. No.00CH37017)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2000-06-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"25","resultStr":"{\"title\":\"Interconnects and transitions in multilayer LTCC multichip modules for 24 GHz ISM-band applications\",\"authors\":\"W. Simon, R. Kulke, A. Wien, M. Rittweger, I. Wolff, A. Girard, J. Bertinet\",\"doi\":\"10.1109/MWSYM.2000.863536\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Multilayer LTCC substrates with screen printed conductors are considered as a key technology for coming RF wireless communication and automotive applications. Small but expensive MMICs should be integrated in a much cheaper LTCC environment to become a multichip module (MCM). Interconnects between the environmental waveguides and the integrated chips have been designed, optimized, fabricated and evaluated by the authors, which are partners in the European R&D project RAMP.\",\"PeriodicalId\":149404,\"journal\":{\"name\":\"2000 IEEE MTT-S International Microwave Symposium Digest (Cat. No.00CH37017)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2000-06-11\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"25\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2000 IEEE MTT-S International Microwave Symposium Digest (Cat. No.00CH37017)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MWSYM.2000.863536\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2000 IEEE MTT-S International Microwave Symposium Digest (Cat. No.00CH37017)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MWSYM.2000.863536","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Interconnects and transitions in multilayer LTCC multichip modules for 24 GHz ISM-band applications
Multilayer LTCC substrates with screen printed conductors are considered as a key technology for coming RF wireless communication and automotive applications. Small but expensive MMICs should be integrated in a much cheaper LTCC environment to become a multichip module (MCM). Interconnects between the environmental waveguides and the integrated chips have been designed, optimized, fabricated and evaluated by the authors, which are partners in the European R&D project RAMP.
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