Zicheng Tang, Xubin Guo, Haihua Wang, Huan Chen and Wenbing Kang
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A new metallization method of modified tannic acid photoresist patterning†
Metal patterning from a modified tannic acid (TA-Boc-MA) photoresist and the processes are designed using protection of hydroxyl groups in tannic acid, formulation into a photoresist, an exposure and pattern treatment process, and metallization by electroless Ag deposition with silver ion solution.
Keywords: Tannic acid; Positive photoresist; Metallization method; Metal patterning; Ag pattern.
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