{"title":"QFN32寄生参数的提取","authors":"Wenjun Xie, G. Wen, Haiyan Jin","doi":"10.1109/YCICT.2009.5382385","DOIUrl":null,"url":null,"abstract":"The Quad Flat No Lead or QFN package, a near CSP lead frame, is a promising choice for portable wireless applications such as BluetoothTM and RF SoC. Excellent attributes of this advanced package include miniaturized footprint, good electrical performance and excellent thermal characteristics. In this paper, the parasitic parameters of one signal path for a typical 32 I/O (0.5 mm pitch)QFN package structure, were extracted precisely using Ansoft HFSS and ADS of the Agilent company.","PeriodicalId":138803,"journal":{"name":"2009 IEEE Youth Conference on Information, Computing and Telecommunication","volume":"29 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Extraction of parasitic parameters for QFN32\",\"authors\":\"Wenjun Xie, G. Wen, Haiyan Jin\",\"doi\":\"10.1109/YCICT.2009.5382385\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The Quad Flat No Lead or QFN package, a near CSP lead frame, is a promising choice for portable wireless applications such as BluetoothTM and RF SoC. Excellent attributes of this advanced package include miniaturized footprint, good electrical performance and excellent thermal characteristics. In this paper, the parasitic parameters of one signal path for a typical 32 I/O (0.5 mm pitch)QFN package structure, were extracted precisely using Ansoft HFSS and ADS of the Agilent company.\",\"PeriodicalId\":138803,\"journal\":{\"name\":\"2009 IEEE Youth Conference on Information, Computing and Telecommunication\",\"volume\":\"29 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2009-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2009 IEEE Youth Conference on Information, Computing and Telecommunication\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/YCICT.2009.5382385\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 IEEE Youth Conference on Information, Computing and Telecommunication","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/YCICT.2009.5382385","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
摘要
Quad Flat No Lead或QFN封装，一个接近CSP的引线框架，是便携式无线应用(如BluetoothTM和RF SoC)的一个有前途的选择。这种先进封装的优异属性包括小型化的占地面积、良好的电气性能和优异的热特性。本文利用安哲伦公司的Ansoft HFSS和ADS精确提取了典型的32 I/O (0.5 mm间距)QFN封装结构的一个信号路径的寄生参数。
The Quad Flat No Lead or QFN package, a near CSP lead frame, is a promising choice for portable wireless applications such as BluetoothTM and RF SoC. Excellent attributes of this advanced package include miniaturized footprint, good electrical performance and excellent thermal characteristics. In this paper, the parasitic parameters of one signal path for a typical 32 I/O (0.5 mm pitch)QFN package structure, were extracted precisely using Ansoft HFSS and ADS of the Agilent company.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
