窄功率填充对PCB PDN噪声的影响

K. Shringarpure, Biyao Zhao, B. Archambeault, A. Ruehli, J. Fan, J. Drewniak
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引用次数: 2

摘要

随着功率噪声裕度的降低,印刷电路板(PCB)输配电网络(PDN)的性能变得越来越重要。本文讨论了用于从直流稳压器向集成电路(IC)输出功率电流以及用于连接去耦电容器的功率区域填充的尺寸的具体问题。随着PCB实际成本的增加,需要窄功率填充,这导致去耦电容器的连接电感增加。本文采用一种经过验证的集总电路模型提取方法,基于第一原理谐振腔模型,演示了典型PCB PDN设计中使用的窄区和宽区填充的影响。由此获得的频域结果与典型的IC电流绘制曲线一起使用,以显示对IC上产生的噪声电压的影响。从这些结果中得出了一些设计准则和结论。
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Effect of narrow power fills on PCB PDN noise
The printed circuit board (PCB) power delivery network (PDN) performance has become critical with the reducing margins on power noise. This paper deals with a specific question about the size of the power area fill used to route the power current from the dc regulator to integrated circuit(IC), and also used for connecting to the decoupling capacitors. With increased PCB real estate costs, narrow power fills are required, which results in an increase in the connection inductance of decoupling capacitors. This paper uses a proven lumped circuit model extraction procedure, based on the first principle resonant cavity model, to demonstrate the effect of narrow and wide area fills used in typical PCB PDN designs. The frequency domain results thus obtained are used with typical IC current draw profiles to show the impact on the noise voltage developed at the IC. Some design guidelines and conclusions are drawn from these results.
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