{"title":"全面数字孪生的实用方法","authors":"Michael Ford, Damian Glover, Lubna Dajani","doi":"10.1109/stc55697.2022.00030","DOIUrl":null,"url":null,"abstract":"In February 2021 IPC, the global association for the electronics industry, published IPC- 2551, an interoperable framework for creation of holistic product digital twins incorporating critical design, production, and supply-chain data. Here we describe how the IPC-2551 standard works in combination with W3C standards Decentralized Identifiers (DIDs) and Verifiable Credentials (VCs) to enable secure, interoperable, privacy-preserving information exchanges between participants in any manufacturing ecosystem.","PeriodicalId":170123,"journal":{"name":"2022 IEEE 29th Annual Software Technology Conference (STC)","volume":"38 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A Practical Approach To A Holistic Digital Twin\",\"authors\":\"Michael Ford, Damian Glover, Lubna Dajani\",\"doi\":\"10.1109/stc55697.2022.00030\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In February 2021 IPC, the global association for the electronics industry, published IPC- 2551, an interoperable framework for creation of holistic product digital twins incorporating critical design, production, and supply-chain data. Here we describe how the IPC-2551 standard works in combination with W3C standards Decentralized Identifiers (DIDs) and Verifiable Credentials (VCs) to enable secure, interoperable, privacy-preserving information exchanges between participants in any manufacturing ecosystem.\",\"PeriodicalId\":170123,\"journal\":{\"name\":\"2022 IEEE 29th Annual Software Technology Conference (STC)\",\"volume\":\"38 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 IEEE 29th Annual Software Technology Conference (STC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/stc55697.2022.00030\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE 29th Annual Software Technology Conference (STC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/stc55697.2022.00030","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
In February 2021 IPC, the global association for the electronics industry, published IPC- 2551, an interoperable framework for creation of holistic product digital twins incorporating critical design, production, and supply-chain data. Here we describe how the IPC-2551 standard works in combination with W3C standards Decentralized Identifiers (DIDs) and Verifiable Credentials (VCs) to enable secure, interoperable, privacy-preserving information exchanges between participants in any manufacturing ecosystem.
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