多尺度仿真:紧凑模型能不仅仅是TCAD和电路仿真之间的单向桥梁吗?

A. Kloes
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引用次数: 1

摘要

今天,对于不同抽象层次的电气模拟,主要有两种模拟框架:TCAD使单个设备的模拟与设备物理密切相关,可能包括量子效应。电路模拟器(如SPICE)使用紧凑的模型来表示具有众多晶体管的电路仿真中的单个器件。对于设计-技术协同优化(DTCO)意义上的两种环境的非常耗时的交互,紧凑模型被用作单向桥:紧凑模型的参数适应TCAD结果,并作为电路仿真的输入,然后根据器件结构的定义反馈电路性能。但是紧凑的模型可以作为电路和TCAD仿真之间的双向桥梁吗?将紧凑模型集成到TCAD仿真中,构建一个联合平台,实现从量子物理到电路仿真的多尺度仿真,是否可能且有利?本文讨论了一个成功地将紧凑模型集成到超短沟道双栅MOSFET的数值器件模拟中的例子。
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Multiscale Simulation: Can Compact Models be More Than a One-Way Bridge Between TCAD and Circuit Simulation?
Today, for electrical simulation on different levels of abstraction there are mainly two simulation frameworks: TCAD enables the simulation of individual devices closely to device physics, possibly including quantum effects. Circuit simulators such as SPICE use compact models to represent individual devices in the simulation of a circuit with numerous transistors. For the very time consuming interaction of both environments in the sense of Design-Technology Co-Optimization (DTCO), compact models are used as one-way bridges: The parameters of a compact model are adapted to TCAD results and serve as input to a circuit simulation, followed by a feedback of circuit performance on the definition of the device structure. But can compact models serve as a bidirectional bridge between circuit and TCAD simulation? Is it possible and advantageous to integrate compact models in TCAD simulations to build a joined platform that enables a multiscale simulation from quantum physics to circuit simulation? In this paper, an example for the successful integration of a compact model into the numerical device simulation of an ultra-short channel double-gate MOSFET is discussed.
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