含铅/无铅焊点的微观结构和焊接热特性比较电学测试

2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2013-10-01 DOI:10.1109/SIITME.2013.6743685

M. Branzei, F. Miculescu, A. Bibiș, I. Cristea, I. Plotog, G. Vărzaru, B. Mihailescu

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引用次数: 10

摘要

焊点的性能是由其微观结构的特定形态决定的。本文介绍了在两种不同冷却速率下，慢速(0.5 K/s)和快速(4 K/s)，使用气相焊接工艺(VPS)的铅/无铅焊锡膏所产生的焊点电阻的比较测量。研究结果将促进该焊接技术的实际应用，并有助于在设计和制造领域更好地选择无铅锡膏。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Lead/lead free solder joints comparative electrical tests as function of microstructure and soldering thermal profile

The solder joints properties are determined by the specific morphology of their microstructure. In the paper are presented the comparative resistance measurements of the solder joints resulted by usage of lead/lead-free solder pastes from Vapor Phase Soldering Processes (VPS) having thermal profile with two different cooling rate, slow one (0.5 K/s) and rapid one (4 K/s). The results will be promote to develop the practical applications of this soldering technology and to contribute at realization of a data base useful for better selection of lead-free solder paste in the design and manufacturing area.

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2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)

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