一种具有批量调度时间建议的灵活集群工具仿真框架

Hsin-Ping Yen, Shiuan-Hau Huang, Yan-Hsiu Liu, Kuang-Hsien Tseng, J. Kung, Yi-Ting Li, Yung-Chih Chen, Chun-Yao Wang
{"title":"一种具有批量调度时间建议的灵活集群工具仿真框架","authors":"Hsin-Ping Yen, Shiuan-Hau Huang, Yan-Hsiu Liu, Kuang-Hsien Tseng, J. Kung, Yi-Ting Li, Yung-Chih Chen, Chun-Yao Wang","doi":"10.1109/ISQED57927.2023.10129375","DOIUrl":null,"url":null,"abstract":"The semiconductor manufacturing process consists of multiple steps and is usually time-consuming. Information like the turnaround time of a certain batch of wafers can be very useful for manufacturing engineers. A simulation model of manufacturing process can help predict the performance of manufacturing process efficiently, which is very beneficial to the manufacturing engineers. The simulation result can also deliver messages to system engineers for achieving better throughput after adjustment. In this work, we propose a flexible simulation framework for a cluster tool. We implemented the simulator in C++ language with SystemC. The batch information used for the design of simulator was gathered from industrial data. The experimental results show that there is only less than 2% difference between the simulation and the manufacturing data in terms of entire processing time, which indicates the high accuracy of the simulator. The experimental results with the proposed dispatching method achieve a higher throughput compared to the manufacturing data such that the dispatching time points can be recommended to the system engineers.","PeriodicalId":315053,"journal":{"name":"2023 24th International Symposium on Quality Electronic Design (ISQED)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-04-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A Flexible Cluster Tool Simulation Framework with Wafer Batch Dispatching Time Recommendation\",\"authors\":\"Hsin-Ping Yen, Shiuan-Hau Huang, Yan-Hsiu Liu, Kuang-Hsien Tseng, J. Kung, Yi-Ting Li, Yung-Chih Chen, Chun-Yao Wang\",\"doi\":\"10.1109/ISQED57927.2023.10129375\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The semiconductor manufacturing process consists of multiple steps and is usually time-consuming. Information like the turnaround time of a certain batch of wafers can be very useful for manufacturing engineers. A simulation model of manufacturing process can help predict the performance of manufacturing process efficiently, which is very beneficial to the manufacturing engineers. The simulation result can also deliver messages to system engineers for achieving better throughput after adjustment. In this work, we propose a flexible simulation framework for a cluster tool. We implemented the simulator in C++ language with SystemC. The batch information used for the design of simulator was gathered from industrial data. The experimental results show that there is only less than 2% difference between the simulation and the manufacturing data in terms of entire processing time, which indicates the high accuracy of the simulator. The experimental results with the proposed dispatching method achieve a higher throughput compared to the manufacturing data such that the dispatching time points can be recommended to the system engineers.\",\"PeriodicalId\":315053,\"journal\":{\"name\":\"2023 24th International Symposium on Quality Electronic Design (ISQED)\",\"volume\":\"16 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2023-04-05\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2023 24th International Symposium on Quality Electronic Design (ISQED)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISQED57927.2023.10129375\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2023 24th International Symposium on Quality Electronic Design (ISQED)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISQED57927.2023.10129375","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

半导体制造过程由多个步骤组成,通常很耗时。像某一批晶圆的周转时间这样的信息对制造工程师来说非常有用。制造过程的仿真模型可以有效地预测制造过程的性能,这对制造工程师是非常有益的。仿真结果也可以为系统工程师提供信息,以便在调整后获得更好的吞吐量。在这项工作中,我们提出了一个灵活的集群工具仿真框架。我们用c++语言和SystemC语言实现了模拟器。用于模拟器设计的批量信息是从工业数据中收集的。实验结果表明,在整个加工时间内,仿真结果与制造数据相差不到2%,表明仿真结果具有较高的精度。实验结果表明,与制造数据相比,该调度方法的吞吐量更高,可以向系统工程师推荐调度时间点。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
A Flexible Cluster Tool Simulation Framework with Wafer Batch Dispatching Time Recommendation
The semiconductor manufacturing process consists of multiple steps and is usually time-consuming. Information like the turnaround time of a certain batch of wafers can be very useful for manufacturing engineers. A simulation model of manufacturing process can help predict the performance of manufacturing process efficiently, which is very beneficial to the manufacturing engineers. The simulation result can also deliver messages to system engineers for achieving better throughput after adjustment. In this work, we propose a flexible simulation framework for a cluster tool. We implemented the simulator in C++ language with SystemC. The batch information used for the design of simulator was gathered from industrial data. The experimental results show that there is only less than 2% difference between the simulation and the manufacturing data in terms of entire processing time, which indicates the high accuracy of the simulator. The experimental results with the proposed dispatching method achieve a higher throughput compared to the manufacturing data such that the dispatching time points can be recommended to the system engineers.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Metal Inter-layer Via Keep-out-zone in M3D IC: A Critical Process-aware Design Consideration HD2FPGA: Automated Framework for Accelerating Hyperdimensional Computing on FPGAs A Novel Stochastic LSTM Model Inspired by Quantum Machine Learning DC-Model: A New Method for Assisting the Analog Circuit Optimization Polynomial Formal Verification of a Processor: A RISC-V Case Study
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1