{"title":"基于视觉识别与激光传感集成的晶圆级自动双探测系统","authors":"Ya-Ting Huang, Rongshun Chen","doi":"10.1109/AMCON.2018.8614880","DOIUrl":null,"url":null,"abstract":"This study develops an automated wafer-level testing system, using visual and laser as the sensing devices, which can be the platform of MEMS measurement at wafer level. The proposed system involves the development of human-machine interface and precisely positioning control, which includes camera module for visual identification, motorized micro positioners, laser sensors for probe positioning automated, and wafer movable stage for the wafer positioning.","PeriodicalId":438307,"journal":{"name":"2018 IEEE International Conference on Advanced Manufacturing (ICAM)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Automated Dual-probing System for Wafer-level Testing Based on the Integration of Visual Identification and Laser Sensing\",\"authors\":\"Ya-Ting Huang, Rongshun Chen\",\"doi\":\"10.1109/AMCON.2018.8614880\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This study develops an automated wafer-level testing system, using visual and laser as the sensing devices, which can be the platform of MEMS measurement at wafer level. The proposed system involves the development of human-machine interface and precisely positioning control, which includes camera module for visual identification, motorized micro positioners, laser sensors for probe positioning automated, and wafer movable stage for the wafer positioning.\",\"PeriodicalId\":438307,\"journal\":{\"name\":\"2018 IEEE International Conference on Advanced Manufacturing (ICAM)\",\"volume\":\"3 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2018 IEEE International Conference on Advanced Manufacturing (ICAM)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/AMCON.2018.8614880\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE International Conference on Advanced Manufacturing (ICAM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/AMCON.2018.8614880","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Automated Dual-probing System for Wafer-level Testing Based on the Integration of Visual Identification and Laser Sensing
This study develops an automated wafer-level testing system, using visual and laser as the sensing devices, which can be the platform of MEMS measurement at wafer level. The proposed system involves the development of human-machine interface and precisely positioning control, which includes camera module for visual identification, motorized micro positioners, laser sensors for probe positioning automated, and wafer movable stage for the wafer positioning.