{"title":"绿色电子用Sn-3.5Ag-0.5La无铅钎料合金的力学性能","authors":"Fahad Sagheer, M. Aamir, M. Sadiq","doi":"10.1109/ICASE54940.2021.9904081","DOIUrl":null,"url":null,"abstract":"Eutectic Tin-Lead solder, commonly 63Sn-37Pb, has been used for times in the electronic industry. However, due to the harmful effects of lead on the environment, many alternatives have been investigated. The Tin-Silver alloys are acknowledged on a large scale as a replacement for traditional Tin-Lead solders due to their excellent mechanical properties. However, to further enhance the properties of Tin-Silver alloys, doping of additional elements is highly acknowledged. In this study, the investigation on the mechanical properties of Sn-3.5Ag solder alloy is carried out after doping 0.5 wt% Lanthanum. The yield strength (YS), ultimate tensile strength (UTS), creep behaviour and hardness are evaluated using tensile tests, creep tests and Brinell hardness measurement, respectively. The composition of alloys is confirmed using energy dispersive spectroscopy, and phase analysis is done by X-ray diffraction. The results showed a significant increase in all mechanical properties after adding Lanthanum into the Tin- Silver alloy.","PeriodicalId":300328,"journal":{"name":"2021 Seventh International Conference on Aerospace Science and Engineering (ICASE)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2021-12-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Mechanical properties of Sn-3.5Ag-0.5La lead-free solder alloy for green electronics\",\"authors\":\"Fahad Sagheer, M. Aamir, M. Sadiq\",\"doi\":\"10.1109/ICASE54940.2021.9904081\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Eutectic Tin-Lead solder, commonly 63Sn-37Pb, has been used for times in the electronic industry. However, due to the harmful effects of lead on the environment, many alternatives have been investigated. The Tin-Silver alloys are acknowledged on a large scale as a replacement for traditional Tin-Lead solders due to their excellent mechanical properties. However, to further enhance the properties of Tin-Silver alloys, doping of additional elements is highly acknowledged. In this study, the investigation on the mechanical properties of Sn-3.5Ag solder alloy is carried out after doping 0.5 wt% Lanthanum. The yield strength (YS), ultimate tensile strength (UTS), creep behaviour and hardness are evaluated using tensile tests, creep tests and Brinell hardness measurement, respectively. The composition of alloys is confirmed using energy dispersive spectroscopy, and phase analysis is done by X-ray diffraction. The results showed a significant increase in all mechanical properties after adding Lanthanum into the Tin- Silver alloy.\",\"PeriodicalId\":300328,\"journal\":{\"name\":\"2021 Seventh International Conference on Aerospace Science and Engineering (ICASE)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-12-14\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2021 Seventh International Conference on Aerospace Science and Engineering (ICASE)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICASE54940.2021.9904081\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 Seventh International Conference on Aerospace Science and Engineering (ICASE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICASE54940.2021.9904081","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Mechanical properties of Sn-3.5Ag-0.5La lead-free solder alloy for green electronics
Eutectic Tin-Lead solder, commonly 63Sn-37Pb, has been used for times in the electronic industry. However, due to the harmful effects of lead on the environment, many alternatives have been investigated. The Tin-Silver alloys are acknowledged on a large scale as a replacement for traditional Tin-Lead solders due to their excellent mechanical properties. However, to further enhance the properties of Tin-Silver alloys, doping of additional elements is highly acknowledged. In this study, the investigation on the mechanical properties of Sn-3.5Ag solder alloy is carried out after doping 0.5 wt% Lanthanum. The yield strength (YS), ultimate tensile strength (UTS), creep behaviour and hardness are evaluated using tensile tests, creep tests and Brinell hardness measurement, respectively. The composition of alloys is confirmed using energy dispersive spectroscopy, and phase analysis is done by X-ray diffraction. The results showed a significant increase in all mechanical properties after adding Lanthanum into the Tin- Silver alloy.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
