E. Hsieh, S. Chung, J.C. Wang, C. S. Lai, C. Tsai, R. Huang, C. Tsai, C. Liang
{"title":"考虑应变和输运效应的应变硅CMOS器件中RDF诱发漏极电流变化的新准则","authors":"E. Hsieh, S. Chung, J.C. Wang, C. S. Lai, C. Tsai, R. Huang, C. Tsai, C. Liang","doi":"10.1109/VLSI-TSA.2012.6210148","DOIUrl":null,"url":null,"abstract":"In this paper, we have studied the Id variation in linear and saturation region by considering the strain-induced effect and the carrier transport of strained CMOS devices. It was found that the origin of linear Id variation comes from the mobility scattering; while in saturation region, the Id variation is dominated by the injection velocity. The higher the injection velocity is, the smaller the saturation Id variation becomes. These results provide us a guideline for achieving good variability control of strain-based CMOS technologies.","PeriodicalId":388574,"journal":{"name":"Proceedings of Technical Program of 2012 VLSI Technology, System and Application","volume":"418 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-04-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"New criteria for the RDF induced drain current variation considering strain and transport effects in strain-silicon CMOS devices\",\"authors\":\"E. Hsieh, S. Chung, J.C. Wang, C. S. Lai, C. Tsai, R. Huang, C. Tsai, C. Liang\",\"doi\":\"10.1109/VLSI-TSA.2012.6210148\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, we have studied the Id variation in linear and saturation region by considering the strain-induced effect and the carrier transport of strained CMOS devices. It was found that the origin of linear Id variation comes from the mobility scattering; while in saturation region, the Id variation is dominated by the injection velocity. The higher the injection velocity is, the smaller the saturation Id variation becomes. These results provide us a guideline for achieving good variability control of strain-based CMOS technologies.\",\"PeriodicalId\":388574,\"journal\":{\"name\":\"Proceedings of Technical Program of 2012 VLSI Technology, System and Application\",\"volume\":\"418 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-04-23\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of Technical Program of 2012 VLSI Technology, System and Application\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/VLSI-TSA.2012.6210148\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of Technical Program of 2012 VLSI Technology, System and Application","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VLSI-TSA.2012.6210148","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
New criteria for the RDF induced drain current variation considering strain and transport effects in strain-silicon CMOS devices
In this paper, we have studied the Id variation in linear and saturation region by considering the strain-induced effect and the carrier transport of strained CMOS devices. It was found that the origin of linear Id variation comes from the mobility scattering; while in saturation region, the Id variation is dominated by the injection velocity. The higher the injection velocity is, the smaller the saturation Id variation becomes. These results provide us a guideline for achieving good variability control of strain-based CMOS technologies.