{"title":"Cu:Sn:S = 8:1:4成分烧结致密体的热电性能与结构","authors":"M. Hasaka, T. Morimura, T. Aki, S. Kondo","doi":"10.1109/ICT.1996.553282","DOIUrl":null,"url":null,"abstract":"The compact of Cu:Sn:S=8:1:4 composition was prepared by sintering. The thermoelectric properties of the compact were measured as a function of temperature and annealing period. The microstructures were investigated by X-ray diffraction experiments and transmission electron microscopic observation. The compact is desirable in thermoelectric properties and thermal stability below 450 K. The compact consists of mixtures of several compound structures.","PeriodicalId":447328,"journal":{"name":"Fifteenth International Conference on Thermoelectrics. Proceedings ICT '96","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"1996-03-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Thermoelectric properties and structures of the sintered compact of Cu:Sn:S = 8:1:4 composition\",\"authors\":\"M. Hasaka, T. Morimura, T. Aki, S. Kondo\",\"doi\":\"10.1109/ICT.1996.553282\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The compact of Cu:Sn:S=8:1:4 composition was prepared by sintering. The thermoelectric properties of the compact were measured as a function of temperature and annealing period. The microstructures were investigated by X-ray diffraction experiments and transmission electron microscopic observation. The compact is desirable in thermoelectric properties and thermal stability below 450 K. The compact consists of mixtures of several compound structures.\",\"PeriodicalId\":447328,\"journal\":{\"name\":\"Fifteenth International Conference on Thermoelectrics. Proceedings ICT '96\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1996-03-26\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Fifteenth International Conference on Thermoelectrics. Proceedings ICT '96\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICT.1996.553282\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Fifteenth International Conference on Thermoelectrics. Proceedings ICT '96","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICT.1996.553282","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Thermoelectric properties and structures of the sintered compact of Cu:Sn:S = 8:1:4 composition
The compact of Cu:Sn:S=8:1:4 composition was prepared by sintering. The thermoelectric properties of the compact were measured as a function of temperature and annealing period. The microstructures were investigated by X-ray diffraction experiments and transmission electron microscopic observation. The compact is desirable in thermoelectric properties and thermal stability below 450 K. The compact consists of mixtures of several compound structures.
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