晶圆厂8T sram基IMC架构的胞内阻开缺陷分析

L. Ammoura, M. Flottes, P. Girard, J. Noel, A. Virazel
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摘要

采用内存计算(IMC)架构是有效解决冯诺依曼瓶颈问题的一种有前途的方法。除了算术运算之外,IMC架构的目标是直接在存储器阵列或/和外围集成额外的逻辑运算,以节省时间和功耗。本文考虑了基于28nm FD-SOI工艺技术的128x128位元阵列的综合模型,以分析IMC 8T SRAM位元在读端口注入电阻性开放缺陷时的行为。为了确定它们对内存和计算模式的影响,以及对局部有缺陷的位单元和全局阵列的影响,进行了分层分析,包括对每个缺陷的详细研究。实验结果表明,IMC模式对阻性开孔缺陷具有最有效的检测效果。
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Intra-cell Resistive-Open Defect Analysis on a Foundry 8T SRAM-based IMC Architecture
The adoption of In-Memory Computing (IMC) architectures is one of the promising approaches to efficiently solve the Von Neumann bottleneck problem. In addition to arithmetic operations, IMC architectures aim at integrating additional logic operations directly in the memory array or/and at the periphery for saving time and power consumption. In this paper, a comprehensive model of a 128x128 bitcell array based on a 28nm FD-SOI process technology has been considered to analyze the behavior of IMC 8T SRAM bitcells in the presence of resistive-open defects injected in the read port. A hierarchical analysis including a detailed study of each defect was performed in order to determine their impact both in memory and computing modes, both locally on the defective bitcell and globally on the array. Experimental results show that the IMC mode offers the most effective detectability of resistive-open defects.
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