Kron simulation of field-to-line coupling using a meshed and a modified Taylor cell

Printed Circuit Board (PCB) traces play a role in the immunity of electronic products. Contrary to Integrated Circuits (ICs), the layout of PCB traces can be changed rather late in a product's design. Therefore, it is interesting to equip the PCB designer with simple tools that predict the immunity of his PCB traces. In this article, we compare two simulations of field-to-long line coupling based on Taylor's model. Firstly, the line is meshed into electrically short Taylor cells and numerically simulated using Kron's method. Secondly, we use one modified Taylor cell, which does not need meshing and is a closed-form, analytical result. The two simulations turn out to be equally precise on a straight microstrip line, the meshed simulation being more flexible, the simulation using a modified Taylor cell being faster.