片上光网络互连体系结构的性能评价

Shiqing Wang, Huaxi Gu
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引用次数: 2

摘要

未来的片上系统(SoC)将包含大量的IP核。传统的基于总线的架构难以扩展、功耗大、占地面积大,已不适合现代芯片设计。片上网络(NoC)是一种利用网络代替总线作为可扩展的全球通信平台的技术,它被用来解决这些问题。然而,随着NoC规模的扩大,有限的带宽、长延迟和高功耗将成为瓶颈。基于硅光互连的光片上网络(ONoC)可以提供显著的带宽和功耗优势,为克服这些限制提供了一个有前途的解决方案。本文对基于2D Mesh、3D Mesh、2D Fat Tree(FT)和2D Butterfly Fat Tree(BFT)拓扑的几种ONoCs进行了端到端延迟和网络吞吐量的仿真和比较。结果表明,在列出的拓扑结构中,3D Mesh具有最好的性能。
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Performance evaluation for optical network-on-chip interconnect architectures
A large number of IP cores will be included in the future systems-on-chip (SoC). Traditional bus-based architectures are no longer suitable for modern chip design, since it is difficult to expand, consumes much power and takes much area. Network-on-chip (NoC), which employs networks to replace buses as a scalable global communication platform, has been proposed to cope with these problems. However, limited bandwidth, long delay and high power consumption will become bottlenecks as NoC scales to large sizes. Based on silicon optical interconnect, optical network-on-chip (ONoC) can offer significant bandwidth and power advantages, which provides a promising solution to overcome these limitations. In this paper, we simulated and compared several ONoCs based on the topologies including 2D Mesh, 3D Mesh, 2D Fat Tree(FT) and 2D Butterfly Fat Tree(BFT) in terms of the end-to-end delay and network throughput. The results showed that 3D Mesh has the best performance among the listed topologies.
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