I/sub DDT/ testing

Yinghua Min, Z. Zhao, Zhongcheng Li
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引用次数: 6

摘要

业界已接受I/sub DDQ/测试来检测CMOS IC缺陷。而I/sub滴滴涕/测试需要更多的研究才能在实践中适用。然而,值得注意的是,观察平均瞬态电流可以导致实际缺陷覆盖率的提高。提出了一种基于布尔过程的I/sub / DDT/可测试故障的形式化识别方法,并生成用于故障检测的输入向量对。有趣的是,这些故障可能无法通过I/sub DDQ/或其他测试方法检测到,这表明了I/sub DDT/测试的重要性。
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I/sub DDT/ testing
The industry has accepted I/sub DDQ/ testing to detect CMOS IC defects. While I/sub DDT/ testing needs more research to be applicable in practice. However, it is noticed that observing the average transient current can lead to improvements in real defect coverage. This paper presents a formal procedure to identify I/sub DDT/ testable faults, and to generate input vector pairs to detect the faults based on Boolean process. It is interesting to note that those faults may not be detected by I/sub DDQ/ or other test methods, which shows the significance of I/sub DDT/ testing.
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