S. Klengel, T. Stephan, Bolko Mühs-Portius, R. Klengel
{"title":"印刷电路板金属化系统中的腐蚀机理","authors":"S. Klengel, T. Stephan, Bolko Mühs-Portius, R. Klengel","doi":"10.1109/ESTC.2018.8546401","DOIUrl":null,"url":null,"abstract":"This paper presents and discusses the results for electrochemical corrosion testing in comparison to mixed flow gas testing (MFG) and salt spray testing for metallization systems of printed circuit boards. High resolution microstructural analyses are giving evidence for the running corrosion mechanism. We will show results of Scanning Electron Microscopy (SEM) and element analyses (EDS) for samples after standard testing and after applying an electrochemical test method. Additionally, also black pad formation will be studied by microstructural analyses and electrochemical testing.","PeriodicalId":198238,"journal":{"name":"2018 7th Electronic System-Integration Technology Conference (ESTC)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Corrosion mechanism in metallization systems for printed circuit boards\",\"authors\":\"S. Klengel, T. Stephan, Bolko Mühs-Portius, R. Klengel\",\"doi\":\"10.1109/ESTC.2018.8546401\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents and discusses the results for electrochemical corrosion testing in comparison to mixed flow gas testing (MFG) and salt spray testing for metallization systems of printed circuit boards. High resolution microstructural analyses are giving evidence for the running corrosion mechanism. We will show results of Scanning Electron Microscopy (SEM) and element analyses (EDS) for samples after standard testing and after applying an electrochemical test method. Additionally, also black pad formation will be studied by microstructural analyses and electrochemical testing.\",\"PeriodicalId\":198238,\"journal\":{\"name\":\"2018 7th Electronic System-Integration Technology Conference (ESTC)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2018 7th Electronic System-Integration Technology Conference (ESTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ESTC.2018.8546401\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 7th Electronic System-Integration Technology Conference (ESTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESTC.2018.8546401","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Corrosion mechanism in metallization systems for printed circuit boards
This paper presents and discusses the results for electrochemical corrosion testing in comparison to mixed flow gas testing (MFG) and salt spray testing for metallization systems of printed circuit boards. High resolution microstructural analyses are giving evidence for the running corrosion mechanism. We will show results of Scanning Electron Microscopy (SEM) and element analyses (EDS) for samples after standard testing and after applying an electrochemical test method. Additionally, also black pad formation will be studied by microstructural analyses and electrochemical testing.
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