{"title":"一种创建再包装载体包的新方法","authors":"Homg-Chang Liu, Chun-Hsiung Chung, Shou-Ming Huang","doi":"10.1109/IPFA.2018.8452586","DOIUrl":null,"url":null,"abstract":"In the past, chemical acid was used to etch out remaining compound on the lead frame to create carrier package for repackage. As an artifact of the process, the silver coating which is needed for a reliable thermosonic bonding is also damaged or etched. This is not acceptable when analyzing failure device. By developing new method in removing the remaining compound after laser ablation, a good carrier package can be produced by submerging device into ethanol and removing remaining compound by polishing fleece.","PeriodicalId":382811,"journal":{"name":"2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A New Method in Creating Carrier Package for Repackage\",\"authors\":\"Homg-Chang Liu, Chun-Hsiung Chung, Shou-Ming Huang\",\"doi\":\"10.1109/IPFA.2018.8452586\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In the past, chemical acid was used to etch out remaining compound on the lead frame to create carrier package for repackage. As an artifact of the process, the silver coating which is needed for a reliable thermosonic bonding is also damaged or etched. This is not acceptable when analyzing failure device. By developing new method in removing the remaining compound after laser ablation, a good carrier package can be produced by submerging device into ethanol and removing remaining compound by polishing fleece.\",\"PeriodicalId\":382811,\"journal\":{\"name\":\"2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"volume\":\"3 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-07-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IPFA.2018.8452586\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2018.8452586","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A New Method in Creating Carrier Package for Repackage
In the past, chemical acid was used to etch out remaining compound on the lead frame to create carrier package for repackage. As an artifact of the process, the silver coating which is needed for a reliable thermosonic bonding is also damaged or etched. This is not acceptable when analyzing failure device. By developing new method in removing the remaining compound after laser ablation, a good carrier package can be produced by submerging device into ethanol and removing remaining compound by polishing fleece.
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