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引用次数: 0

摘要

碳化硅是一种宽带隙半导体材料。尽管人们已经知道它好几年了,但研究人员仍在继续从基础和应用方面对它进行研究。SiC用于在高功率、高温和高辐射条件下工作的器件。这种材料的典型应用是在现代光电器件中用作衬底材料。碳化硅结构的基础是构成它的两种元素的原子的四面体配位。主要相为/spl α /-SiC(闪锌矿结构)和/spl β /-SiC(纤锌矿结构)。除了这两种相外,还鉴定出了大约200种碳化硅相。本文报道了等离子体反应物以不同方式输送的IPD法制备SiC层的研究。结果表明,该合成产物是由DLC基体和/spl α /-SiC 51R型SiC单晶构成的复合材料,晶粒尺寸约为100nm。根据硅的添加方法(固态源,TMS),层材料中的硅含量在2%至13%之间。
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SiC/DLC composite layers synthesised by the IPD method
Silicon carbide is a wide band gap semiconductor material. Although it has been known for several years, investigators continue to examine it in fundamental as well as application terms. SiC is used in devices operated under high-power, high temperature and high radiation conditions. A typical application of this material is its use as a substrate material in modern opto-electronic devices. The foundation of the SiC structure is a tetrehedral coordination of the atoms of both the elements that form it. The principal phases are: /spl alpha/-SiC (blende structure), and /spl beta/-SiC (wurtzite structure). In addition to these two phases, about 200 phases of SiC have been identified. The paper reports on the studies on the synthesis of SiC layers using the IPD method with the plasma reactants being delivered in various manners. It has been found that the product of the synthesis is a composite material built of a DLC matrix and SiC single crystals of the /spl alpha/-SiC 51R type, with grain sizes of about 100nm. Depending on the silicon dosing method (solid state source, TMS), the silicon content in the layer material ranged from 2 to 13%.
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