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3rd International Conference 'Novel Applications of Wide Bandgap Layers' Abstract Book (Cat. No.01EX500)最新文献

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New carbon based material layers for medical application 新型医用碳基材料层
M. Guseva, V. Babaev, N. D. Novikov, N. Bistrova
Materials based on the linear chain carbon (sp-bonds between atoms) and their applications are described. Such materials were found to be promising biomaterials. The materials are produced by specific chemical and physical processes. Carbion (an improved analogue of carbylan) has a polymeric basis, bearing on its surface a linear-chain carbon layer with long chains, oriented mainly along the surface. Carbion fiber and carbion-coated materials are prepared by chemical modification (via the dehydrohalogenation reaction of the original polymeric substance, namely polyvinylidene halide). The carbion materials and implants mentioned above are fibers knitted with carbion-coated fiber nets and other products (sutures, artificial knitted vascular vessels, urethras, etc.).
介绍了基于线性链碳(原子间sp键)的材料及其应用。这些材料被认为是很有前途的生物材料。这些材料是通过特定的化学和物理过程生产出来的。碳(一种改进的羧酸酯类似物)具有聚合物基础,其表面有一个长链的线性链碳层,主要沿表面取向。碳纤维和碳包覆材料是通过化学改性(通过原聚合物质即聚偏二卤乙烯的脱氢卤化反应)制备的。上述碳材料和植入物是指用碳包覆纤维网等产品(缝合线、人工编织血管、尿道等)编织的纤维。
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引用次数: 0
Changes in electrical properties of thin diamond films under heat treatment 热处理下金刚石薄膜电性能的变化
S. Kulesza, F. Rozpłoch
The authors present results on both temperature-dependent resistivity (/spl rho/(T)) measurements and current-voltage (I(V)) characteristics of polycrystalline diamond thin films chemically vapour deposited by hot filament (HF-CVD) method from propane-butane gas mixture diluted in hydrogen. The films were deposited on single crystal silicon substrates. In-plane and out-of-plane I-V characteristics of the same sample are shown and observed differences are discussed, which clearly attest to concurrent transport mechanisms in the films. Then, changes in the samples resistivity under heat treatment in vacuum are presented. The authors show that a simple exponential /spl rho/(T) model is inadequate to explain the results, since distinctive peaks are found in the characteristics. Further, observed changes are analysed in terms of gradual dehydrogenation of the samples. The results indicate that electrical properties of CVD diamond films may be to some extent controlled by their proper dehydrogenation either in vacuum or in an inert gas atmosphere.
作者介绍了用热丝(HF-CVD)法在氢气稀释的丙烷-丁烷气体混合物中化学气相沉积的多晶金刚石薄膜的电阻率(/spl rho/(T))和电流电压(I(V))特性的结果。薄膜被沉积在单晶硅衬底上。显示了同一样品的面内和面外I-V特性,并讨论了观察到的差异,这清楚地证明了薄膜中的并发输运机制。分析了真空热处理过程中试样电阻率的变化规律。作者表明,简单的指数/spl rho/(T)模型不足以解释结果,因为在特征中发现了明显的峰。此外,根据样品的逐渐脱氢分析了观察到的变化。结果表明,CVD金刚石薄膜的电学性能在一定程度上可以由真空或惰性气体中适当的脱氢来控制。
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引用次数: 0
Radiotherapy dosimetry: a novel application for polycrystalline diamond thin films 放射剂量学:多晶金刚石薄膜的新应用
G. Conte, P. Acarelli, E. Cappelli, A. Fidanzio, A. Piermattei, M. Rossi, S. Salvatori, C. Venanzi
The aim of this paper is to report on the tailoring of the physical properties of polycrystalline CVD diamond in order to fulfil the requirements of radiotherapy dosimeters. A very simple device geometry has been used to study the electronic response of the polycrystalline CVD layers and results achieved with a 6 MV bremsstrahlung X-ray beam delivered by a linear accelerator are presented and discussed.
本文的目的是报道多晶CVD金刚石的物理性质的裁剪,以满足放射剂量计的要求。本文采用一种非常简单的器件结构来研究多晶CVD层的电子响应,并介绍和讨论了由直线加速器发射的6 MV轫致x射线束所获得的结果。
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引用次数: 0
Diamond layers for active electronic devices 有源电子器件用金刚石层
H. Okushi
This paper reviews our recent achievements in homoepitaxial CVD diamond layers for electronic devices. We have successfully synthesized high quality homoepitaxial diamond layers with atomically flat surface by the microwave plasma chemical vapor deposition (CVD) using a low CH4 concentration of CH4/H2 gas system less than 0.15% CH4/H2 ratio and Ib (001) substrates with low-misorientation angle less than 1.5°. These layers have atomically flat and have excellent electrical and optical properties. For example, highquality Schottky junctions between Al and p-type high-conductivity layer near the surface of these layers have been obtained. Based on this growth method, we have also successfully synthesized B-doped diamond layers using trimethylboron [B(CH3)3,TMB] gas as a B doping source, whose Hall mobility is 1840 cm2/Vs at 290 K. Schottky junctions fabricated by the B-doped diamond also show excellent performances, indicating that the quality of these diamond layers is device grade.
本文综述了近年来在电子器件用同外延CVD金刚石层的研究进展。采用微波等离子体化学气相沉积(CVD)技术,以低CH4浓度的CH4/H2气体体系(CH4/H2比小于0.15%)和低取向角小于1.5°的Ib(001)衬底,成功地合成了具有原子平坦表面的高质量同外延金刚石层。这些层具有原子平面,并具有优异的电学和光学性能。例如,在这些层表面附近的Al和p型高导电性层之间获得了高质量的肖特基结。基于这种生长方法,我们还成功地以三甲基硼[B(CH3)3,TMB]气体为B掺杂源合成了B掺杂金刚石层,其在290 K下的霍尔迁移率为1840 cm2/Vs。b掺杂金刚石制备的肖特基结也表现出优异的性能,表明这些金刚石层的质量是器件级的。
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引用次数: 0
Characterization of nanocrystalline diamond for cutting aluminium alloys 切削铝合金用纳米晶金刚石的表征
W. Kaczorowski, A. Gołąbczak, J. Grabarczyk, P. Louda, P. Niedzielski
Nanocrystalline diamond has very attractive properties such as low friction coefficient, low wear resistance and chemical inertness. It also has a very high hardness. The characteristics of NCD makes it a good candidate for a wide range of tribological applications such as bearings, gears, cutting tools for machining non-ferrous metals, plastics, chip-board and composite materials. Hard carbon coatings are known to have good antisticking properties with respect to aluminum. In this paper, characterization experiments of nanocrystalline diamond for cutting aluminium are presented.
纳米晶金刚石具有低摩擦系数、低耐磨性和化学惰性等非常吸引人的特性。它也有很高的硬度。NCD的特性使其成为广泛的摩擦学应用的良好候选者,如轴承,齿轮,加工有色金属,塑料,刨花板和复合材料的切削工具。众所周知,硬碳涂层相对于铝具有良好的防粘性能。本文介绍了用于切割铝的纳米晶金刚石的表征实验。
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引用次数: 0
Ion-induced electron-emission from diamond 离子诱导的金刚石电子发射
R. Kalish, V. Richter, B. Fizgeer, N. Koenigsfeld, Y. Avigal, A. Hoffman, E. Cheifetz, D. Hoxley
Electron emission from diamond surfaces has recently attracted much attention due to the outstanding physical and electrical properties of diamond (including the negative electron affinity (NEA) that some diamond surfaces exhibit). In general, induced electron emission from any material involves three stages: (I) the excitation of electrons in the bulk; (II) their transport to the surface and (III) the escape of the electrons into the vacuum. The ion induced electron emission (IIEE) yield (/spl gamma/) is defined as the number of emitted electrons per incident ion. It was found to depend on the electronic energy loss of the moving ion in the material. For clean metal surfaces /spl gamma/ is usually about 2-5, however for conducting, boron doped, hydrogenated diamond layers amazingly large values for the IIEE yield (reaching 150 for 200 keV proton bombardment) were recently reported. These large values suggest the use of diamond as a material for the realization of "single ion detectors". Furthermore, the unique way electron-hole pairs are created by ion impact, and the large depth inside the material where they are generated, may also shed light on the processes involved in the other forms of electron emission from diamond. Here the authors present results of IIEE from differently treated and different kinds of diamonds: (i) Boron doped CVD diamond on Si, grain size of the order of a few microns. (ii) Undoped CVD diamond layers, grain size of the order of a few microns. (iii) Boron doped CVD diamond thin layers with sub-micron grain size. (iv) Boron doped CVD diamond thin membranes (free standing) with sub-micron grain size, for which electrons emitted both backwards and forwards are measured.
由于金刚石优异的物理和电学性能(包括某些金刚石表面所表现出的负电子亲和性),金刚石表面的电子发射近年来引起了人们的广泛关注。一般来说,任何材料的感应电子发射包括三个阶段:(1)体中电子的激发;(II)它们向表面的传输和(III)电子逃逸到真空中。离子诱导电子发射(IIEE)产率(/spl γ /)定义为每个入射离子发射的电子数。发现它取决于材料中移动离子的电子能量损失。对于清洁的金属表面/spl γ /通常约为2-5,然而对于导电,硼掺杂,氢化金刚石层,最近报道了惊人的IIEE产率值(200 keV质子轰击达到150)。这些大的数值表明,金刚石可以作为实现“单离子探测器”的材料。此外,离子撞击产生电子-空穴对的独特方式,以及它们在材料内部产生的大深度,也可能为钻石其他形式的电子发射过程提供线索。在这里,作者介绍了不同处理和不同种类的金刚石的IIEE结果:(1)硼掺杂CVD金刚石在Si上,晶粒尺寸为几微米。(ii)未掺杂的CVD金刚石层,晶粒尺寸为几微米数量级。(3)亚微米级的硼掺杂CVD金刚石薄层。(iv)亚微米级硼掺杂CVD金刚石薄膜(独立),测量其前后发射电子。
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引用次数: 0
Forming carbon films on cemented carbide surface using RF PCVD method 用射频PCVD法在硬质合金表面形成碳膜
J. Grabarczyk, P. Niedzielski, P. Louda
The aim of the project described in this paper was to examine the influence parameters of deposition and the method of location of samples on an RF-power electrode in the RF-PCVD method on the structure of carbon coatings, which covered cemented carbide substrates. This researches precedes an investigation concerning the covering of cemented carbide cutting tools by wear resistant carbon films, with were used in wood industry for milling of wood-base materials. As an object of investigation cutter head plates made of cemented carbide were used. Their size was about 30/spl times/12/spl times/1.5. In the deposition processes two types of parameters were applied: so-called "hard" parameters, when the bias voltage was higher then 500V, and "soft" parameters, when the bias voltage was less then 400V. In addition the flow of methane, pressure, and time of deposition were changed. In order to properly locate the cutting edge on the electrode three types of holders were used. Every process of depositing the carbon film on a cemented carbide substrate was preceded by one hour of ion etching.
本课题的目的是研究RF-PCVD方法中射频功率电极上的沉积参数和样品定位方法对覆盖硬质合金基体的碳涂层结构的影响。本文对木材工业中用于铣削木质基材料的硬质合金刀具的耐磨碳膜涂层进行了研究。以硬质合金刀头板为研究对象。它们的大小约为30/spl倍/12/spl倍/1.5。在沉积过程中应用了两类参数:所谓的“硬”参数,当偏置电压高于500V时,以及“软”参数,当偏置电压低于400V时。此外,甲烷流量、压力和沉积时间也发生了变化。为了在电极上正确定位切削刃,使用了三种类型的夹具。在硬质合金衬底上沉积碳膜的每个过程之前都要进行一小时的离子蚀刻。
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引用次数: 0
Wide bandgap materials in thermal management of electronic structures 宽禁带材料在电子结构热管理中的应用
P. Gielisse, H. Niculescu, J. Tremblay, S. Achmatowicz, M. Jakobowski, E. Zwierkowska, L. Golonka
The need for optimized thermal management in microelectronic devices derives from several sources, of which the ever-increasing miniaturization is only one. Power dissipation needs in certain designs are up to 40 W/cm/sup 2/, while 100 W/cm/sup 2/ is said to be required in the not too distant future. New multilayer ceramic integrated circuits (MCIC's) contain many "buried heat sources" in the form of resistors, capacitors, and inductors, the volume of which are increasing as well. Microelectronic packages and circuits and particularly high power microelectronics, require both temperature and temperature gradient control. The first primarily assures that the components are kept below a certain temperature threshold, providing reliability. Keeping the circuit between specific low and high temperature boundaries, primarily effects performance and structural considerations. Where other solutions are not available due to size, thermal load, or other systems considerations, a cold plate-a substrate equipped with liquid flow channels-could be resorted to. In most cases, however, the complexity that cold plates introduce, cannot be tolerated if for no reason other than cost. Heat exchange via a high thermal conductivity substrate connected to an appropriate heat sink must, in most cases, be relied on. Electrically conducting (metallic) substrates have become available but most applications require it to be a dielectric, exemplified by the most widely used "electronic" alumina (Al/sub 2/O/sub 3/, 96%) with an average thermal conductivity value of 20 W/mK. The last five years or so have seen an increase in the use of polycrystalline AlN (k/spl cong/175 W/mK). Its application has also been limited due to cost. Substrates based on yet another (polycrystalline) wide bandgap material, SiC (250 W/mK), are again too costly for most applications and are conductive. Furthermore, SiC occurs in several polymorphic forms and many polytypes i.e., it is hard to obtain phase pure, potentially causing property variations. SiC as well as diamond are available in single crystal thin film form and various quality (conductivity) grades. Commercially available polycrystalline thin film diamond ranges in TC value between 750 and 1500 W/mK. The as-deposited material displays a high surface roughness requiring, in most cases, extensive and thus expensive polishing to "planarize" it to receive the electronic circuitry.
微电子器件对优化热管理的需求有几个来源,其中不断增加的小型化只是一个。某些设计的功耗需求高达40 W/cm/sup 2/,而据说在不久的将来需要100 W/cm/sup 2/。新型多层陶瓷集成电路(MCIC)包含许多以电阻、电容和电感形式存在的“地埋热源”,其体积也在不断增加。微电子封装和电路,特别是高功率微电子,需要温度和温度梯度控制。第一个主要是确保组件保持在一定的温度阈值以下,提供可靠性。保持电路在特定的低温和高温边界之间,主要影响性能和结构考虑。如果由于尺寸,热负荷或其他系统考虑而无法使用其他解决方案,则可以采用冷板-配备有液体流动通道的基板。然而,在大多数情况下,冷板带来的复杂性是不能容忍的,如果没有其他原因,除了成本。在大多数情况下,必须依靠连接到适当散热器的高导热基板进行热交换。导电(金属)衬底已经可用,但大多数应用要求它是电介质,例如最广泛使用的“电子”氧化铝(Al/sub 2/O/sub 3/, 96%),平均导热系数为20 W/mK。过去五年左右,多晶AlN (k/spl长/175 W/mK)的使用有所增加。由于成本的原因,其应用也受到限制。基于另一种(多晶)宽禁带材料SiC (250 W/mK)的衬底对于大多数应用来说再次过于昂贵并且具有导电性。此外,SiC以多种多态形式和多种多型形式存在,即难以获得相纯,从而可能导致性能变化。SiC和金刚石有单晶薄膜形式和各种质量(电导率)等级。市售的多晶薄膜金刚石的TC值在750到1500 W/mK之间。沉积的材料显示出很高的表面粗糙度,在大多数情况下,需要广泛而昂贵的抛光才能使其“平坦”以接收电子电路。
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引用次数: 2
Interaction of body fluids with carbon surfaces 体液与碳表面的相互作用
B. Walkowiak, W. Jakubowski, W. Okrój, V. Kochmanska, V. Króliczak
The use of medical implants allows one to improve patients lives, and quite often it can return patients back to normal activity in their personal and professional lives. One of the most difficult problems, which is necessary to solve, is a proper selection of the materials to be used for implant construction and/or implant coating. The surface of an implant is exposed to continuous contact with body fluids and several unwanted processes may occur there. Titanium and its alloys are generally accepted as the best tolerated materials for implants. But currently many efforts are focused on thin layers of crystalline carbon, i.e. diamond like carbon (DLC) and nanocrystalline diamond (NCD), used for coating of metal implants. This technology was successfully applied in bone surgery (screws), and more recently in heart surgery (stents). We found, with the fluorescence microscopy technique, that bacterial growth was possible on stainless steel, to a lesser degree on titanium, but NCD was almost totally resistant to bacterial colonization.
医疗植入物的使用可以改善患者的生活,并且通常可以使患者恢复正常的个人和职业生活。正确选择种植体结构和/或种植体涂层的材料是最困难的问题之一,也是必须解决的问题之一。植入物的表面暴露在与体液的持续接触中,那里可能会发生一些不想要的过程。钛及其合金是公认的最耐受性的植入材料。但目前许多努力都集中在薄层晶体碳上,即金刚石样碳(DLC)和纳米晶金刚石(NCD),用于金属植入物的涂层。该技术已成功应用于骨手术(螺钉),最近又应用于心脏手术(支架)。我们发现,通过荧光显微镜技术,细菌可以在不锈钢上生长,在钛上生长的程度较低,但NCD几乎完全抵抗细菌的定植。
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引用次数: 7
Numerical simulation of field effect transistors in 4H and 6H-SiC 4H和6H-SiC场效应晶体管的数值模拟
Hans-Erik Nilsson, Kent Bertilsson, E. Dubaric, M. Hjelm
Silicon Carbide is a very interesting semiconductor material for high temperature, high frequency, and high power applications. The main reasons are its high saturation velocity, large thermal conductivity, high Schottky barriers, and high breakdown voltages. High quality 4H-SiC and 6H-SiC polytype substrates and epitaxial layers are commercially available today. An additional advantage of SiC is the native oxide that allows fabrication of MOS devices. A large effort has been devoted towards the development of high performance devices in SiC. The largest success has been for unipolar devices like Schottky diodes and different kinds of MESFETs. MOSFETs have also been fabricated in both 4H- and 6H-SiC. Unfortunately, the MOSFET performance was found to be much worse than expected, due to a very low surface mobility. Nevertheless, the technology developed is very interesting and includes possible large scale integration of digital circuits operating at very high temperatures. In this work we present numerical simulations of the device performance of different Field Effect Transistors (FETs). Both full band Monte Carlo simulations and macroscopic modeling using the drift-diffusion approach have been utilized in this work. The Monte Carlo simulations have been used to extract transport parameters and to evaluate the macroscopic models in a device configuration.
碳化硅是一种非常有趣的半导体材料,适用于高温、高频和高功率应用。其主要原因是饱和速度高、导热系数大、肖特基势垒高、击穿电压高。高质量的4H-SiC和6H-SiC多型衬底和外延层目前已商品化。SiC的另一个优点是其天然氧化物可用于制造MOS器件。在高性能碳化硅器件的开发上已经投入了大量的努力。最大的成功是单极器件,如肖特基二极管和不同种类的mesfet。在4H-和6H-SiC中也制备了mosfet。不幸的是,由于表面迁移率非常低,MOSFET的性能比预期的要差得多。然而,这项技术的发展非常有趣,包括在高温下工作的数字电路的大规模集成。在这项工作中,我们给出了不同场效应晶体管(fet)器件性能的数值模拟。全波段蒙特卡罗模拟和宏观建模使用漂移扩散方法已经在这项工作中使用。蒙特卡罗模拟已被用于提取输运参数和评估宏观模型在一个设备配置。
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引用次数: 7
期刊
3rd International Conference 'Novel Applications of Wide Bandgap Layers' Abstract Book (Cat. No.01EX500)
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