{"title":"双纳秒脉冲激光钻孔的烧蚀机理","authors":"Xuejun Wang","doi":"10.1109/SOPO.2012.6270918","DOIUrl":null,"url":null,"abstract":"Thirty nanosecond 1.064 μm laser pulses separated by 150 nanoseconds have been shown up to ten times material removal rates while minimizing redeposition and heat-affected zones. The diameter of hole entrance is approximately 450 μm and half hole taper angle is 12 degree. The internal wall of the hole is bright black, no recast layer, no microcrack, smooth and no burr. The laser bursts drilling model is put forward and instantaneous process of laser drilling is discussed.","PeriodicalId":159850,"journal":{"name":"2012 Symposium on Photonics and Optoelectronics","volume":"41 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-05-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Ablation Mechanisms of Double Nanosecond Pulses Laser Drilling\",\"authors\":\"Xuejun Wang\",\"doi\":\"10.1109/SOPO.2012.6270918\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Thirty nanosecond 1.064 μm laser pulses separated by 150 nanoseconds have been shown up to ten times material removal rates while minimizing redeposition and heat-affected zones. The diameter of hole entrance is approximately 450 μm and half hole taper angle is 12 degree. The internal wall of the hole is bright black, no recast layer, no microcrack, smooth and no burr. The laser bursts drilling model is put forward and instantaneous process of laser drilling is discussed.\",\"PeriodicalId\":159850,\"journal\":{\"name\":\"2012 Symposium on Photonics and Optoelectronics\",\"volume\":\"41 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-05-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2012 Symposium on Photonics and Optoelectronics\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SOPO.2012.6270918\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 Symposium on Photonics and Optoelectronics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SOPO.2012.6270918","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Ablation Mechanisms of Double Nanosecond Pulses Laser Drilling
Thirty nanosecond 1.064 μm laser pulses separated by 150 nanoseconds have been shown up to ten times material removal rates while minimizing redeposition and heat-affected zones. The diameter of hole entrance is approximately 450 μm and half hole taper angle is 12 degree. The internal wall of the hole is bright black, no recast layer, no microcrack, smooth and no burr. The laser bursts drilling model is put forward and instantaneous process of laser drilling is discussed.