频率高达100ghz的通孔阵列中差分串扰的物理缩放效应

Katharina Scharff, David Dahl, H. Brüns, C. Schuster
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引用次数: 4

摘要

铜缆链路上的数据速率现在已经超过了50gbps,这就需要至少100ghz的频域分析。这项工作首次研究了频率高达100ghz的通孔阵列内差分串扰的频率行为。结果表明,串扰并不随频率的增加而无限增加。我们评估了高效的建模工具(如基于物理的通过建模)是否可用于高达100 GHz的串扰评估,并将结果与全波解决方案进行了比较。一个具有单个腔的简化模型足以预测阵列内串扰的总体频率依赖性。研究了缩小阵列几何尺寸的影响。经孔间距被确定为影响最大的参数。对于50ghz的频率,将通孔间距从80mil降低到40mil可以减少约30db的串扰。
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Physical scaling effects of differential crosstalk in via arrays up to frequencies of 100 GHz
Data rates on copper-based links are now increasing beyond 50 Gbps which requires frequency-domain analyses up to at least 100 GHz. This work investigates for the first time the frequency behavior of differential crosstalk inside a via array for frequencies up to 100 GHz. It is shown that the crosstalk does not increase indefinitely with frequency. We evaluate if efficient modeling tools like the physics-based via modeling can be used for crosstalk assessments up to 100 GHz and compare the results with full-wave solutions. A reduced model with a single cavity is sufficient to predict the overall frequency dependence of the crosstalk inside the array. The effect of scaling down the geometry of the array is investigated. The via pitch is identified as the parameter with the greatest impact. For a frequency of 50 GHz a reduction of the via pitch from 80 mil to 40 mil could reduce the crosstalk by about 30 dB.
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