在变异性抑制过程中测量超低电压下由STI应力和反向窄通道效应引起的Vth变化

Y. Ogasahara, M. Hioki, T. Nakagawa, T. Sekigawa, T. Tsutsumi, H. Koike
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引用次数: 1

摘要

本文论证了由sti诱导的掺杂重分布引起的v移对超低电压设计的显著影响。在65nm SOTB CMOS工艺上测量了超低电压下由STI引起的2.5X离子变化。由于反向窄通道效应,还观察到严重的6X离子变化。我们提出了一种基于环形振荡器的测量方法,利用SOTB过程的后门偏置,利用灵活的Vth可控性来观察Vth漂移。
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Measurement of Vth variation due to STI stress and inverse narrow channel effect at ultra-low voltage in a variability-suppressed process
This paper demonstrates notable impact of Vth shift due to STI-induced dopant redistribution on ultra-low voltage designs. 2.5X Ion change at ultra-low voltages due to STI was measured on a 65nm SOTB CMOS process. Serious 6X Ion change due to inverse narrow channel effects was also observed. We propose ring oscillator based measurement procedure observing Vth shift by exploiting flexible Vth controllability by backgate biasing of SOTB process.
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