Y. Notani, Y. Nakajima, Y. Ohta, Y. Mitsui, M. Nakayama, S. Murakami, S. Orisaka, O. Ishihara, S. Mitsui
{"title":"采用多层TAB带的GaAs多芯片功率放大器模块","authors":"Y. Notani, Y. Nakajima, Y. Ohta, Y. Mitsui, M. Nakayama, S. Murakami, S. Orisaka, O. Ishihara, S. Mitsui","doi":"10.1109/GAAS.1994.636952","DOIUrl":null,"url":null,"abstract":"A novel packaging technology using a multi-layer Tape Automated Bonding (TAB) tape was developed for a GaAs multi-chip module to be employed in radio units of mobile telephones. The microwave properties of the multi-layer TAB tape were first evaluated using a ring resonator and a through-line. Then, the TAB tape was applied to a 900 MHz-band high power amplifier. It consists of two MMIC chips and an output matching circuit formed on the TAB tape. The amplifier module delivered a saturated output power of 31.6 dBm with a power added efficiency of 54.9% at 933 MHz with a supply voltage Vdd of 3.3 V. These results suggest that the TAB tape assembly has a high potentiality for realizing a thin and light weight RF unit in mobile communication terminals with low cost.","PeriodicalId":328819,"journal":{"name":"Proceedings of 1994 IEEE GaAs IC Symposium","volume":"20 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-10-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"GaAs multi-chip power amplifier module using a multi-layer TAB tape\",\"authors\":\"Y. Notani, Y. Nakajima, Y. Ohta, Y. Mitsui, M. Nakayama, S. Murakami, S. Orisaka, O. Ishihara, S. Mitsui\",\"doi\":\"10.1109/GAAS.1994.636952\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A novel packaging technology using a multi-layer Tape Automated Bonding (TAB) tape was developed for a GaAs multi-chip module to be employed in radio units of mobile telephones. The microwave properties of the multi-layer TAB tape were first evaluated using a ring resonator and a through-line. Then, the TAB tape was applied to a 900 MHz-band high power amplifier. It consists of two MMIC chips and an output matching circuit formed on the TAB tape. The amplifier module delivered a saturated output power of 31.6 dBm with a power added efficiency of 54.9% at 933 MHz with a supply voltage Vdd of 3.3 V. These results suggest that the TAB tape assembly has a high potentiality for realizing a thin and light weight RF unit in mobile communication terminals with low cost.\",\"PeriodicalId\":328819,\"journal\":{\"name\":\"Proceedings of 1994 IEEE GaAs IC Symposium\",\"volume\":\"20 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1994-10-16\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of 1994 IEEE GaAs IC Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/GAAS.1994.636952\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of 1994 IEEE GaAs IC Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/GAAS.1994.636952","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
GaAs multi-chip power amplifier module using a multi-layer TAB tape
A novel packaging technology using a multi-layer Tape Automated Bonding (TAB) tape was developed for a GaAs multi-chip module to be employed in radio units of mobile telephones. The microwave properties of the multi-layer TAB tape were first evaluated using a ring resonator and a through-line. Then, the TAB tape was applied to a 900 MHz-band high power amplifier. It consists of two MMIC chips and an output matching circuit formed on the TAB tape. The amplifier module delivered a saturated output power of 31.6 dBm with a power added efficiency of 54.9% at 933 MHz with a supply voltage Vdd of 3.3 V. These results suggest that the TAB tape assembly has a high potentiality for realizing a thin and light weight RF unit in mobile communication terminals with low cost.
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