质量通孔阵列的传热性能研究

2019 IEEE National Aerospace and Electronics Conference (NAECON) Pub Date : 2019-07-01 DOI:10.1109/NAECON46414.2019.9058183

Devin A. Smarra, M. Wicks, V. Chodavarapu

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引用次数: 1

摘要

本文分析了传统质量通孔阵列(MVA)的传热性能。对MVAs进行了建模和仿真，并与热通孔阵列(TVA)的等效测量结果进行了比较。基于这一分析，我们确定与常规tva相比，具有许多分散散热片的MVA具有更好的散热效果。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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A Study of the Heat Spreading Capabilities of Mass Via Arrays

This paper analyzes the heat spreading capabilities of conventional Mass Via Arrays (MVA). Modelling and simulation are performed for MVAs and are compared to equivalent measurements for Thermal Via Arrays (TVA). Based on this analysis we determine that an MVA with many interspersed heat spreaders provides superior heat spreading when compared to regular TVAs.

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2019 IEEE National Aerospace and Electronics Conference (NAECON)

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