化学修整涂层:用于193nm光刻的增强成分和工艺

Cong Liu, Kevin Rowell, L. Joesten, P. Baranowski, Irvinder Kaur, Wanyi Huang, JoAnne Leonard, Hae-Mi Jeong, Kwang-Hwyi Im, Tom Estelle, C. Cutler, G. Pohlers, Wenyan Yin, P. Fallon, Mingqi Li, H. Jeon, C. Xu, P. Trefonas
{"title":"化学修整涂层:用于193nm光刻的增强成分和工艺","authors":"Cong Liu, Kevin Rowell, L. Joesten, P. Baranowski, Irvinder Kaur, Wanyi Huang, JoAnne Leonard, Hae-Mi Jeong, Kwang-Hwyi Im, Tom Estelle, C. Cutler, G. Pohlers, Wenyan Yin, P. Fallon, Mingqi Li, H. Jeon, C. Xu, P. Trefonas","doi":"10.1117/12.2219688","DOIUrl":null,"url":null,"abstract":"As the critical dimension of devices is approaching the resolution limit of 193nm photo lithography, multiple patterning processes have been developed to print smaller CD and pitch. Multiple patterning and other advanced lithographic processes often require the formation of isolated features such as lines or posts by direct lithographic printing. The formation of isolated features with an acceptable process window, however, can pose a challenge as a result of poor aerial image contrast at defocus. Herein we report a novel Chemical Trimming Overcoat (CTO) as an extra step after lithography that allows us to achieve smaller feature size and better process window.","PeriodicalId":193904,"journal":{"name":"SPIE Advanced Lithography","volume":"2 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-03-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Chemical trimming overcoat: an enhancing composition and process for 193nm lithography\",\"authors\":\"Cong Liu, Kevin Rowell, L. Joesten, P. Baranowski, Irvinder Kaur, Wanyi Huang, JoAnne Leonard, Hae-Mi Jeong, Kwang-Hwyi Im, Tom Estelle, C. Cutler, G. Pohlers, Wenyan Yin, P. Fallon, Mingqi Li, H. Jeon, C. Xu, P. Trefonas\",\"doi\":\"10.1117/12.2219688\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"As the critical dimension of devices is approaching the resolution limit of 193nm photo lithography, multiple patterning processes have been developed to print smaller CD and pitch. Multiple patterning and other advanced lithographic processes often require the formation of isolated features such as lines or posts by direct lithographic printing. The formation of isolated features with an acceptable process window, however, can pose a challenge as a result of poor aerial image contrast at defocus. Herein we report a novel Chemical Trimming Overcoat (CTO) as an extra step after lithography that allows us to achieve smaller feature size and better process window.\",\"PeriodicalId\":193904,\"journal\":{\"name\":\"SPIE Advanced Lithography\",\"volume\":\"2 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-03-25\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"SPIE Advanced Lithography\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1117/12.2219688\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"SPIE Advanced Lithography","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1117/12.2219688","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4

摘要

随着器件的关键尺寸接近193nm光刻的分辨率极限,多种图像化工艺被开发出来以打印更小的CD和间距。多重图案和其他先进的平版印刷工艺通常需要通过直接平版印刷形成孤立的特征,如线条或柱子。然而,在可接受的处理窗口内形成孤立的特征,可能会由于散焦时航空图像对比度差而构成挑战。在此,我们报告了一种新的化学修整涂层(CTO)作为光刻后的额外步骤,使我们能够实现更小的特征尺寸和更好的工艺窗口。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
Chemical trimming overcoat: an enhancing composition and process for 193nm lithography
As the critical dimension of devices is approaching the resolution limit of 193nm photo lithography, multiple patterning processes have been developed to print smaller CD and pitch. Multiple patterning and other advanced lithographic processes often require the formation of isolated features such as lines or posts by direct lithographic printing. The formation of isolated features with an acceptable process window, however, can pose a challenge as a result of poor aerial image contrast at defocus. Herein we report a novel Chemical Trimming Overcoat (CTO) as an extra step after lithography that allows us to achieve smaller feature size and better process window.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
SEM based overlay measurement between resist and buried patterns Contrast optimization for 0.33NA EUV lithography Analysis of wafer heating in 14nm DUV layers GPU accelerated Monte-Carlo simulation of SEM images for metrology Lensless hyperspectral spectromicroscopy with a tabletop extreme-ultraviolet source
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1