采用高击穿、高fmax多端口堆叠晶体管拓扑结构的75 - 105 GHz开关功率放大器

K. Datta, H. Hashemi
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引用次数: 10

摘要

本文提出了高击穿、高fmax多端口晶体管拓扑结构,用于实现75-105 GHz的高功率、高效率毫米波开关功率放大器。在90nm SiGe BiCMOS工艺中实现,由两个和三个堆叠晶体管组成的有源结构具有集成布局寄生,分别实现(fmax,击穿电压)为(295 GHz, 8V)和(260 GHz, 11 V),在85 GHz和83 GHz分别显示峰值(输出功率,PAE)为(22 dBm, 19%)和(23.3 dBm, 17%)。实现的设计针对88 GHz 19.5 dBm, 16% PAE w波段e类功率放大器进行基准测试,该功率放大器采用相同的90nm SiGe BiCMOS工艺制造的本地晶体管足迹。复合晶体管设计的优异性能突出了所提出方法的优点。
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75 – 105 GHz switching power amplifiers using high-breakdown, high-fmax multi-port stacked transistor topologies
High-breakdown, high-fmax multi-port transistor topologies are presented in this work for realizing high power, highly efficient mm-wave switching power amplifiers at 75-105 GHz. Implemented in a 90nm SiGe BiCMOS process, the proposed active structures comprising of two and three stacked transistors with integrated layout parasitics achieve (fmax, breakdown voltage) of (295 GHz, 8V) and (260 GHz, 11 V) respectively and demonstrate peak (output power, PAE) of (22 dBm, 19%) at 85 GHz and (23.3 dBm, 17%) at 83 GHz respectively. The implemented designs are benchmarked against a 88 GHz 19.5 dBm, 16% PAE W-band Class-E power amplifier using native transistor footprints fabricated in the same 90nm SiGe BiCMOS process. The superior performance of the composite transistor designs highlight the benefit of the proposed approach.
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