Malika Tlili, Maina Sinou, Camilla Kärnfelt, D. Bourreau, A. Péden
{"title":"LTCC微热管的设计与制造","authors":"Malika Tlili, Maina Sinou, Camilla Kärnfelt, D. Bourreau, A. Péden","doi":"10.1109/ESTC.2018.8546402","DOIUrl":null,"url":null,"abstract":"This paper presents work on micro heat pipe (MHP) fabrication in Low Temperature Cofired Ceramics (LTCC) modules for cooling purpose. The MHPs are fabricated in a 10 layer structure using ESL41020 tape. Different fabrication settings have been tested to minimize swelling and groove deformation. The best result is obtained by using fugitive tape, extended firing profile, and hot lamination at 50°C for 5 minutes with 70 bar pressure.","PeriodicalId":198238,"journal":{"name":"2018 7th Electronic System-Integration Technology Conference (ESTC)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Micro Heat Pipe Design and Fabrication on LTCC\",\"authors\":\"Malika Tlili, Maina Sinou, Camilla Kärnfelt, D. Bourreau, A. Péden\",\"doi\":\"10.1109/ESTC.2018.8546402\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents work on micro heat pipe (MHP) fabrication in Low Temperature Cofired Ceramics (LTCC) modules for cooling purpose. The MHPs are fabricated in a 10 layer structure using ESL41020 tape. Different fabrication settings have been tested to minimize swelling and groove deformation. The best result is obtained by using fugitive tape, extended firing profile, and hot lamination at 50°C for 5 minutes with 70 bar pressure.\",\"PeriodicalId\":198238,\"journal\":{\"name\":\"2018 7th Electronic System-Integration Technology Conference (ESTC)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2018 7th Electronic System-Integration Technology Conference (ESTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ESTC.2018.8546402\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 7th Electronic System-Integration Technology Conference (ESTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESTC.2018.8546402","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
This paper presents work on micro heat pipe (MHP) fabrication in Low Temperature Cofired Ceramics (LTCC) modules for cooling purpose. The MHPs are fabricated in a 10 layer structure using ESL41020 tape. Different fabrication settings have been tested to minimize swelling and groove deformation. The best result is obtained by using fugitive tape, extended firing profile, and hot lamination at 50°C for 5 minutes with 70 bar pressure.
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