{"title":"智能移动设备中现代芯片再利用和再制造的挑战","authors":"Sitek Janusz, Koscielski Marek, Arazna Aneta, Stęplewski Wojciech, Janeczek Kamil","doi":"10.1109/EGG.2016.7829846","DOIUrl":null,"url":null,"abstract":"The overview of the main challenges and barriers related with the issues of reuse and remanufacturing of components from smart mobile devices were presented. The authors mainly focused on the current state of the art as well as the preliminary remarks from first investigation of the “sustainablySMART” H2020 project were presented. It was stated that both in reuse and remanufacturing processes of modern chips the main role plays: economic profitability of processes, environmental benefits and costs of processing needed for remanufacturing of components, as well as technical feasibility of components remanufacturing in the way enable their safe application in other products.","PeriodicalId":187870,"journal":{"name":"2016 Electronics Goes Green 2016+ (EGG)","volume":"20 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Challenges of reuse and remanufacturing of modern chips in smart mobile devices\",\"authors\":\"Sitek Janusz, Koscielski Marek, Arazna Aneta, Stęplewski Wojciech, Janeczek Kamil\",\"doi\":\"10.1109/EGG.2016.7829846\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The overview of the main challenges and barriers related with the issues of reuse and remanufacturing of components from smart mobile devices were presented. The authors mainly focused on the current state of the art as well as the preliminary remarks from first investigation of the “sustainablySMART” H2020 project were presented. It was stated that both in reuse and remanufacturing processes of modern chips the main role plays: economic profitability of processes, environmental benefits and costs of processing needed for remanufacturing of components, as well as technical feasibility of components remanufacturing in the way enable their safe application in other products.\",\"PeriodicalId\":187870,\"journal\":{\"name\":\"2016 Electronics Goes Green 2016+ (EGG)\",\"volume\":\"20 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 Electronics Goes Green 2016+ (EGG)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EGG.2016.7829846\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 Electronics Goes Green 2016+ (EGG)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EGG.2016.7829846","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Challenges of reuse and remanufacturing of modern chips in smart mobile devices
The overview of the main challenges and barriers related with the issues of reuse and remanufacturing of components from smart mobile devices were presented. The authors mainly focused on the current state of the art as well as the preliminary remarks from first investigation of the “sustainablySMART” H2020 project were presented. It was stated that both in reuse and remanufacturing processes of modern chips the main role plays: economic profitability of processes, environmental benefits and costs of processing needed for remanufacturing of components, as well as technical feasibility of components remanufacturing in the way enable their safe application in other products.
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