有机电子学-迈向多功能系统的低成本异质集成平台?

K. Bock
{"title":"有机电子学-迈向多功能系统的低成本异质集成平台?","authors":"K. Bock","doi":"10.1109/POLYTR.2005.1596525","DOIUrl":null,"url":null,"abstract":"Current trends in the development of electronics systems show, that the provision of thin flexible components and semiconductors plays a decisive role in the steadily progressing development of highly integrated systems. A new generation of thin flexible electronic systems arises. At present, this world is very much dominated by inorganic active materials, in particular thin flexible silicon integrated circuits, but new functionality based on conductive and semi-conductive plastic materials is developing fast. Freedom of design, compact portable products, cost-effective production and assembly, environment friendly materials, software based printed ICs, flexible polymer transistors and thin flexible silicon ICS-there are unquestionable advantages of flexible electronics. Microsystems incorporating fluidic, mechanical, optical and electrical components are under research and development at present. A new word, \"polytronics\" (polymer+electronics) has appeared in electronic vocabulary as a short name of this quickly developed technology. This paper aims to present an overview of these technologies.","PeriodicalId":436133,"journal":{"name":"Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics","volume":"124 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Organic Electronics - Towards a Cost-Efficient Heterointegration Platform for Multi-Functional Systems?\",\"authors\":\"K. Bock\",\"doi\":\"10.1109/POLYTR.2005.1596525\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Current trends in the development of electronics systems show, that the provision of thin flexible components and semiconductors plays a decisive role in the steadily progressing development of highly integrated systems. A new generation of thin flexible electronic systems arises. At present, this world is very much dominated by inorganic active materials, in particular thin flexible silicon integrated circuits, but new functionality based on conductive and semi-conductive plastic materials is developing fast. Freedom of design, compact portable products, cost-effective production and assembly, environment friendly materials, software based printed ICs, flexible polymer transistors and thin flexible silicon ICS-there are unquestionable advantages of flexible electronics. Microsystems incorporating fluidic, mechanical, optical and electrical components are under research and development at present. A new word, \\\"polytronics\\\" (polymer+electronics) has appeared in electronic vocabulary as a short name of this quickly developed technology. This paper aims to present an overview of these technologies.\",\"PeriodicalId\":436133,\"journal\":{\"name\":\"Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics\",\"volume\":\"124 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2005-10-23\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/POLYTR.2005.1596525\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/POLYTR.2005.1596525","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

摘要

当前电子系统的发展趋势表明,薄型柔性元件和半导体的提供在高度集成系统的稳步发展中起着决定性的作用。新一代薄型柔性电子系统应运而生。目前,无机活性材料在很大程度上主导了这个世界,特别是薄柔性硅集成电路,但基于导电和半导电塑料材料的新功能正在迅速发展。设计自由、产品紧凑便携、生产和组装成本效益高、材料环保、基于软件的印刷集成电路、柔性聚合物晶体管和薄型柔性硅集成电路——这些都是柔性电子产品无可置疑的优势。目前正在研究和开发包含流体、机械、光学和电子元件的微系统。在电子词汇中出现了一个新词“polytronics”(聚合物+电子学),作为这种迅速发展的技术的简称。本文旨在对这些技术进行概述。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
Organic Electronics - Towards a Cost-Efficient Heterointegration Platform for Multi-Functional Systems?
Current trends in the development of electronics systems show, that the provision of thin flexible components and semiconductors plays a decisive role in the steadily progressing development of highly integrated systems. A new generation of thin flexible electronic systems arises. At present, this world is very much dominated by inorganic active materials, in particular thin flexible silicon integrated circuits, but new functionality based on conductive and semi-conductive plastic materials is developing fast. Freedom of design, compact portable products, cost-effective production and assembly, environment friendly materials, software based printed ICs, flexible polymer transistors and thin flexible silicon ICS-there are unquestionable advantages of flexible electronics. Microsystems incorporating fluidic, mechanical, optical and electrical components are under research and development at present. A new word, "polytronics" (polymer+electronics) has appeared in electronic vocabulary as a short name of this quickly developed technology. This paper aims to present an overview of these technologies.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
CMP of PC, PMMA and SU-8 Polymers Numerical Approach to Characterization of Thermally Conductive Adhesives Lead-free Assembly Defects in Plastic Ball Grid Array Packages Selection criteria of press-materials and packaging conditions for power electron devices Conductive Adhesives containing Ag-Sn Alloys as Conductive Filler
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1