{"title":"嵌入式电源是一种用于ipem和pebb封装的多层集成技术","authors":"Zhenxian Liang, F. Lee, G. Lu, D. Borojevic","doi":"10.1109/IWIPP.2000.885179","DOIUrl":null,"url":null,"abstract":"A packaging integration technology, embedded power, has been developed for fabrication of integrated power electronics modules (IPEMs) and power electronics building blocks (PEBBs). The bare power chips are buried in the ceramic frame and encapsulated with screen-printed dielectric. High-density interconnect metallization between power devices and surface mountable electronics circuitry was fabricated using sputtering and electroplating technologies. Prototype modules have demonstrated the feasibility of this packaging approach.","PeriodicalId":359131,"journal":{"name":"IWIPP 2000. International Workshop on Integrated Power Packaging (Cat. No.00EX426)","volume":"45 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-07-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"14","resultStr":"{\"title\":\"Embedded power-a multilayer integration technology for packaging of IPEMs and PEBBs\",\"authors\":\"Zhenxian Liang, F. Lee, G. Lu, D. Borojevic\",\"doi\":\"10.1109/IWIPP.2000.885179\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A packaging integration technology, embedded power, has been developed for fabrication of integrated power electronics modules (IPEMs) and power electronics building blocks (PEBBs). The bare power chips are buried in the ceramic frame and encapsulated with screen-printed dielectric. High-density interconnect metallization between power devices and surface mountable electronics circuitry was fabricated using sputtering and electroplating technologies. Prototype modules have demonstrated the feasibility of this packaging approach.\",\"PeriodicalId\":359131,\"journal\":{\"name\":\"IWIPP 2000. International Workshop on Integrated Power Packaging (Cat. No.00EX426)\",\"volume\":\"45 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2000-07-14\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"14\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IWIPP 2000. International Workshop on Integrated Power Packaging (Cat. No.00EX426)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IWIPP.2000.885179\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IWIPP 2000. International Workshop on Integrated Power Packaging (Cat. No.00EX426)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IWIPP.2000.885179","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Embedded power-a multilayer integration technology for packaging of IPEMs and PEBBs
A packaging integration technology, embedded power, has been developed for fabrication of integrated power electronics modules (IPEMs) and power electronics building blocks (PEBBs). The bare power chips are buried in the ceramic frame and encapsulated with screen-printed dielectric. High-density interconnect metallization between power devices and surface mountable electronics circuitry was fabricated using sputtering and electroplating technologies. Prototype modules have demonstrated the feasibility of this packaging approach.
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