多核系统实时应用的快速最坏情况峰值温度评估

Lars Schor, Iuliana Bacivarov, Hoeseok Yang, L. Thiele
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引用次数: 5

摘要

目前,多核系统的可靠性受到芯片高温的威胁,导致长期可靠性问题和短期功能错误。在实时系统中,高芯片温度甚至会导致潜在的截止日期违规。因此,只有将最坏峰值温度纳入实时分析,才能保证正确的功能。然而,在设计空间探索过程中,计算数百种设计方案的峰值温度非常耗时。在本文中,我们解决了这一挑战,并提出了一种快速解析方法来计算具有非确定性工作负载的多核实时系统的最高温度的非平凡上界。所考虑的热模型能够解决各种热效应,如邻近核心之间的热交换和温度相关的泄漏功率。最后,将该方法应用于多核ARM平台,验证了该方法的有效性和准确性。
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Fast worst-case peak temperature evaluation for real-time applications on multi-core systems
The reliability of multi-core systems is nowadays threatened by high chip temperatures leading to long-term reliability concerns and short-term functional errors. In real-time systems, high chip temperatures are even adherent to potential deadline violations. Therefore, correct functionality can only be guaranteed if the worst-case peak temperature is incorporated in real-time analysis. However, calculating the peak temperature of hundreds of design alternatives during design space exploration is time-consuming. In this paper, we address this challenge and present a fast analytic method to calculate a non-trivial upper bound on the maximum temperature of a multi-core real-time system with non-deterministic workload. The considered thermal model is able to address various thermal effects like heat exchange between neighboring cores and temperature-dependent leakage power. Finally, the proposed method is applied to a multi-core ARM platform to validate its efficiency and accuracy.
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