可重构系统中热传感器的优化配置与放置及其实用推广

Byunghyun Lee, Taewhan Kim
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引用次数: 7

摘要

利用热传感器对硬件资源的热行为进行动态监测,对维护系统的安全可靠运行具有重要意义。这项工作提出了一个有效的解决方案,热传感器的分配和安置在可重构系统的后制造阶段的问题。具体来说,我们定义了传感器的分配与放置问题(SAPP),并提出了一种将SAPP转化为覆盖问题(UCP)的解决方案。然后,我们提供了一个扩展的解决方案来处理一个实际的设计问题,其中用于在特定阵列位置上实现传感器的硬件资源已经被应用程序逻辑用完。使用MCNC基准的实验结果表明,我们提出的技术使用的传感器数量平均比基于对分法(Mukherjee et al., 2006)的方法少19.7%。
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Optimal allocation and placement of thermal sensors for reconfigurable systems and its practical extension
A dynamic monitoring of thermal behavior of hardware resources using thermal sensors is very important to maintain the operation of systems safe and reliable. This work proposes an effective solution to the problem of thermal sensor allocation and placement for reconfigurable systems at the post-manufacturing stage. Specifically, we define the sensor allocation and placement problem (SAPP), and propose a solution which formulates SAPP into the unate-covering problem (UCP) and solves it optimally. We then provide an extended solution to handle a practical design issue where the hardware resources for the sensor implementation on specific array locations have already been used up by the application logic. Experimental results using MCNC benchmarks show that our proposed technique uses 19.7% less number of sensors to monitor hotspots on the average than that used by the bisection based (Mukherjee et al., 2006) approaches.
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