不同可靠性条件下锡晶须自发生长的观察

2008 58th Electronic Components and Technology Conference Pub Date : 2008-05-27 DOI:10.1109/ECTC.2008.4550172

Sungwon Han, Kyung-Seob Kim, Chung-Hee Yu, M. Osterman, M. Pecht

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引用次数: 10

摘要

本研究考察了镀锡合金42铅架和铜铅架在常温条件下保存4年、样品经烘烤后在常温条件下保存、样品在55plusmn1degC/85plusmn3%条件下保存3000小时的锡须生长情况。对其生长倾向和生长机制进行了分析。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Observations of the spontaneous growth of tin whiskers in various reliability conditions

This study evaluated the growth of tin whiskers on tin plated alloy 42 lead-frames and copper lead-frames stored in ambient conditions for 4 years, samples stored in ambient conditions after a post-bake treatment, and stored at 55plusmn1degC/85plusmn3% conditions for 3000 hours. Analysis was conducted to investigate the propensity and the mechanisms of growth.

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2008 58th Electronic Components and Technology Conference

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