LTCC三维微波和毫米波模块集成平台

2012 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT) Pub Date : 2012-11-01 DOI:10.1109/RFIT.2012.6401625

T. Vaha-Heikkila, M. Lahti

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引用次数: 6

摘要

本文介绍了低温共烧陶瓷(LTCC)技术平台，它是多芯片模块的集成平台。LTCC平台也非常适合实现从射频到毫米波频率的天线阵列、滤波器和其他无源器件。文中给出了实现组件和模块的实例。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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LTCC 3D integration platform for microwave and millimeter wave modules

This paper introduces Low Temperature Co-Fired Ceramics (LTCC) technology platform which is an integration platform for multi chip modules. LTCC platform is also well suited for the realization of antenna arrays, filters and other passives from RF to millimeter wave frequencies. Examples of realized components and modules are presented in the paper.

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2012 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT)

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