{"title":"稳健的过程能力指数跟踪过程确认","authors":"Cong Gu, C. McAndrew","doi":"10.1109/ICMTS.2015.7106108","DOIUrl":null,"url":null,"abstract":"This paper presents a robust process qualification and monitoring procedure based on the recently developed YAT and YWL process capability indices. Combined with appropriate test structures and measurements the procedure enables rapid process maturity evaluation and on-going loop closure of manufacturing to process specifications. The procedure generates interactive web-based reports and data that provide high-level “scoring” and a time-line of process capability, an ability to quickly dive down and identify the root cause of issues, and capability to compare between fabs.","PeriodicalId":177627,"journal":{"name":"Proceedings of the 2015 International Conference on Microelectronic Test Structures","volume":"3 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-03-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Robust process capability index tracking for process qualification\",\"authors\":\"Cong Gu, C. McAndrew\",\"doi\":\"10.1109/ICMTS.2015.7106108\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents a robust process qualification and monitoring procedure based on the recently developed YAT and YWL process capability indices. Combined with appropriate test structures and measurements the procedure enables rapid process maturity evaluation and on-going loop closure of manufacturing to process specifications. The procedure generates interactive web-based reports and data that provide high-level “scoring” and a time-line of process capability, an ability to quickly dive down and identify the root cause of issues, and capability to compare between fabs.\",\"PeriodicalId\":177627,\"journal\":{\"name\":\"Proceedings of the 2015 International Conference on Microelectronic Test Structures\",\"volume\":\"3 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-03-23\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the 2015 International Conference on Microelectronic Test Structures\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICMTS.2015.7106108\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 2015 International Conference on Microelectronic Test Structures","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICMTS.2015.7106108","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Robust process capability index tracking for process qualification
This paper presents a robust process qualification and monitoring procedure based on the recently developed YAT and YWL process capability indices. Combined with appropriate test structures and measurements the procedure enables rapid process maturity evaluation and on-going loop closure of manufacturing to process specifications. The procedure generates interactive web-based reports and data that provide high-level “scoring” and a time-line of process capability, an ability to quickly dive down and identify the root cause of issues, and capability to compare between fabs.